Abstract: A module for a turbomachine, including a guide blade arrangement, a seal carrier that is situated radially within an inner platform of the guide blade arrangement, seal carrier walls, namely, a first seal carrier wall and a second seal carrier wall, and a sliding body as well as a connecting element. The seal carrier walls have a multipart design with respect to one another, and the second seal carrier wall is fastened to the first seal carrier wall and to the seal carrier via the connecting element. The sliding body holds the seal carrier walls at a distance from one another in such a way that they mutually axially delimit a clearance in which the guide blade arrangement engages via a radially inwardly extending guide pin. A radially inner section of the second seal carrier wall has frictional contact relative to the seal carrier.

Abstract: This invention is for holding components made of a ferromagnetic material parallel to a component axis for electroplating the component. The component substrate according to the invention has at least two magnet poles, oriented toward the components and having opposite polarity. The magnet field lines extend from one magnet pole to the other magnet pole through the components only in the vicinity of a contact faces of the components oriented toward the magnet poles. This prevents ferromagnetic particles from depositing on the ends of the components remote from the contact faces. The apparatus according to the invention is especially suitable for holding a plurality of components during electrolytic surface coating of the components.

Abstract: The flexible printed circuit device, includes at least one hybrid circuit structure having assigned contact areas, a rigid printed circuit board, a flexible printed circuit board portion also having assigned contact areas on one end region thereof and being connected electrically to the rigid printed circuit board, a plurality of bonding electrical conductors, each of the electrical conductors being bonded at one end thereof to one of the assigned contact areas on the at least one hybrid circuit structure and, at the other end thereof, to one of the assigned contact areas on the end region of the flexible printed circuit board portion; and a rigid support, the hybrid circuit structure being mounted on the rigid support. The end region of the flexible printed circuit board portion is fixedly mounted on the rigid support in side-by-side relationship with the hybrid circuit structure.

Abstract: Very fine solder-coated conduction paths are made on ceramic, glass or enamel substrates by the combination of a first step in thick-film technology followed by the photo-masking and etching steps typical of thin-film technology, after which galvanic reinforcement of the initial calcined copper paste layer is performed in the locations where the initial layer is exposed by the developed mask. A lead-tin solder layer is then galvanically deposited, which is thicker than the mask, after which the mask is removed and the newly exposed portions of the initial copper layer are etched away. A reflow treatment of the solder layer pattern consolidates the solder layer by melting on top of the boundaries of the unetched initial copper layer. It is possible to obtain conduction path spacings down to 50 .mu.m with conduction paths coated with solder that have excellent adhesion to ceramic, glass or enamel substrates.