Abstract: Process and apparatus for spreading a chip web from a supply over a width corresponding to the web width on a substrate moving below the supply. Such spreading is accomplished according to a web height distribution specified in the web transversely to the direction of web travel. The apparatus includes a rake-like distribution device and a distribution chute arranged between the supply and the web laydown for the purpose of eliminating defects caused by delivery elements in the transverse distribution of the chip web. An arrangement of several rakes inclined toward one another functions to control the transverse chip distribution.