Abstract: A latch secures an element such as a motor-vehicle headrest for movement relative to a support between a rest position and an advanced position. A pivotal lever can hold the element in the rest position. A spring pushes the element into the advanced position and presses it against the lever so as to apply a torque to the lever that presses a latch formation on the lever against a retractile latch part of an actuator. If the actuator retracts the part, the lever is released and the lever can pivot to allow the spring to move the element into the advanced position.

Abstract: A latch secures an element such as a motor-vehicle headrest for movement relative to a support between a rest position and an advanced position. A pivotal lever can hold the element in the rest position. A spring pushes the element into the advanced position and presses it against the lever so as to apply a torque to the lever that presses a latch formation on the lever against a retractile latch part of an actuator. If the actuator retracts the part, the lever is released and the lever can pivot to allow the spring to move the element into the advanced position.

Abstract: An apparatus for the treatment of semi-conductor wafers is provided. The apparatus has a first valve mechanism for introducing different treatment fluids into a treatment tank from different reservoirs. At least one collection device is provided for collecting a treatment fluid after treatment of wafers therewith in the treatment tank. A second valve mechanism is provided for conveying at least a portion of the treatment fluid out of the collection device and to a respective reservoir. A rinsing mechanism is provided for rinsing the collection device.

Abstract: In a method of treating substrates a treatment fluid is fed into a collection vessel after treatment, at least a portion of the treatment fluid is withdrawn from the collection vessel and returned to respective reservoir and the collection vessel is rinsed before receiving another treatment fluid.

Abstract: The aim of the invention is to reduce the chemical consumption in a method for treating substrates, especially semiconductor wafers, in a treatment vessel, into which different treatment fluids from respective containers are introduced in succession in order to treat the substrates. To this end, the invention provides that a treatment fluid is fed into a collection vessel after a treatment, at least one portion of the treatment fluid is withdrawn from the collection vessel and returned into the respective container, and the collection vessel is rinsed after the withdrawal of a treatment fluid and before receiving another treatment fluid. The invention also relates to a device for treating substrates, especially semiconductor wafers, in a treatment vessel.