Patents by Inventor Manhtien Phan

Manhtien Phan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10558252
    Abstract: Techniques pertaining to powering multiple platforms with a minimum impact on air passage in a predefined environment are disclosed. Instead of connecting each of the platforms in a chassis to a power supply therein, embodiments of the present invention uses what is referred to as cascading powering to power all platforms within minimum cable delivery. According to one embodiment of the present invention, a motherboard is disposed between two power supply units that are used to power the motherboard. The motherboard has power connectors located towards or near the power supply units so that only short cables are needed to power the platform.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: February 11, 2020
    Assignee: SUPER MICRO COMPUTER, INC.
    Inventor: Manhtien Phan
  • Publication number: 20190171271
    Abstract: Techniques pertaining to powering multiple platforms with a minimum impact on air passage in a predefined environment are disclosed. Instead of connecting each of the platforms in a chassis to a power supply therein, embodiments of the present invention uses what is referred to as cascading powering to power all platforms within minimum cable delivery. According to one embodiment of the present invention, a motherboard is disposed between two power supply units that are used to power the motherboard. The motherboard has power connectors located towards or near the power supply units so that only short cables are needed to power the platform.
    Type: Application
    Filed: February 4, 2019
    Publication date: June 6, 2019
    Inventor: Manhtien Phan
  • Patent number: 10198055
    Abstract: Techniques pertaining to powering multiple platforms with a minimum impact on air passage in a predefined environment are disclosed. Instead of connecting each of the platforms in a chassis to a power supply therein, embodiments of the present invention uses what is referred to as cascading powering to power all platforms within minimum cable delivery. According to one embodiment of the present invention, a motherboard is disposed between two power supply units that are used to power the motherboard. The motherboard has power connectors located towards or near the power supply units so that only short cables are needed to power the platform.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: February 5, 2019
    Assignee: SUPER MICRO COMPUTER, INC.
    Inventor: Manhtien Phan
  • Publication number: 20170168538
    Abstract: Techniques pertaining to powering multiple platforms with a minimum impact on air passage in a predefined environment are disclosed. Instead of connecting each of the platforms in a chassis to a power supply therein, embodiments of the present invention uses what is referred to as cascading powering to power all platforms within minimum cable delivery. According to one embodiment of the present invention, a motherboard is disposed between two power supply units that are used to power the motherboard. The motherboard has power connectors located towards or near the power supply units so that only short cables are needed to power the platform.
    Type: Application
    Filed: February 28, 2017
    Publication date: June 15, 2017
    Inventor: Manhtien Phan
  • Patent number: 9583918
    Abstract: Techniques pertaining to powering multiple platforms with a minimum impact on air passage in a predefined environment are disclosed. Instead of connecting each of the platforms in a chassis to a power supply therein, the present invention uses what is referred to as cascading powering to power all platforms within minimum cable delivery. According to one embodiment of the present invention, a power supply is disposed between two groups of platforms and powers them at the same time. At least one of the platforms has a power connector located towards or near the power supply so that only a short cable is needed to power the platform.
    Type: Grant
    Filed: August 29, 2010
    Date of Patent: February 28, 2017
    Assignee: SUPER MICRO COMPUTER, INC.
    Inventor: Manhtien Phan
  • Patent number: 7813146
    Abstract: Techniques pertaining to powering multiple platforms with a minimum impact on air passage in a predefined environment are disclosed. Instead of connecting each of the platforms in a chassis to a power supply therein, the present invention uses what is referred to as cascading powering to power all platforms within minimum cable delivery. According to one embodiment of the present invention, each platform is provided with a pair of power connectors. At least one of the platforms has a power connector located towards or near a power supply so that only a short cable is needed to power the platform. The power is serially provided to an adjacent platform via a pair of corresponding connectors, each located on one of the two adjacent platforms. Such configuration is extended to the remaining platforms. As a result, all platforms are powered by the same power supply without using individual cables directly to the power supply.
    Type: Grant
    Filed: October 11, 2006
    Date of Patent: October 12, 2010
    Assignee: Super Micro Computer, Inc.
    Inventor: Manhtien Phan
  • Patent number: 5935230
    Abstract: At least two clusters of CPUs are present in a multiprocessor computer system. Each CPU cluster has a given number of CPUs, each CPU having an associated ID such as an ID number. An additional ID number, not associated with a CPU in the same cluster, is associated with the opposite CPU cluster that appears to the original cluster as a "phantom" processor. A round-robin bus arbitration scheme allows ordered ownership of a common bus within a first cluster until the ID reaches the "phantom" processor, at which time bus ownership passes to a CPU in the second cluster. This arrangement is preferably symmetric, so that when a CPU from the first cluster requests ownership of the bus, it is granted bus ownership by virtue of the first cluster's appearance to the second cluster as a "phantom" CPU.
    Type: Grant
    Filed: July 9, 1997
    Date of Patent: August 10, 1999
    Assignee: Amiga Development, LLC
    Inventors: Felix Pinai, Manhtien Phan