Patents by Inventor Manish Saini

Manish Saini has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip stack with a higher power chip on the outside of the stack
    Publication number: 20070290333
    Abstract: In some embodiments, a system includes a circuit board, a first chip, and a second chip stacked on the first chip. The first chip is coupled between the circuit board and the second chip, and the first chip includes circuitry to repeats commands the first chip receives to the second chip. Other embodiments are described.
    Type: Application
    Filed: June 16, 2006
    Publication date: December 20, 2007
    Inventors: Manish Saini, Deepa S. Mehta