Patents by Inventor Manolo G. Mena

Manolo G. Mena has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8343369
    Abstract: A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.
    Type: Grant
    Filed: July 14, 2011
    Date of Patent: January 1, 2013
    Assignee: Analog Devices, Inc.
    Inventors: Manolo G. Mena, Elmer S. Lacsamana, William A. Webster, Lawrence E. Felton
  • Publication number: 20110266639
    Abstract: A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.
    Type: Application
    Filed: July 14, 2011
    Publication date: November 3, 2011
    Applicant: ANALOG DEVICES, INC.
    Inventors: Manolo G. Mena, Elmer S. Lacsamana, William A. Webster, Lawrence E. Felton
  • Publication number: 20080225505
    Abstract: A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.
    Type: Application
    Filed: May 29, 2008
    Publication date: September 18, 2008
    Applicant: ANALOG DEVICES, INC.
    Inventors: John R. Martin, Manolo G. Mena, Elmer S. Lacsamana, Michael P. Duffy, William A. Webster, Lawrence E. Felton, Maurice S. Karpman
  • Patent number: 7416984
    Abstract: A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.
    Type: Grant
    Filed: August 9, 2004
    Date of Patent: August 26, 2008
    Assignee: Analog Devices, Inc.
    Inventors: John R. Martin, Manolo G. Mena, Elmer S. Lacsamana, Maurice S. Karpman