Patents by Inventor Manuel Seckel

Manuel Seckel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8861220
    Abstract: The invention relates to a method for generating an electronic system for application to freeform surfaces, a method for producing freeform surfaces having an electronic system, and an electronic system and a combination of a freeform surface having at least one such system. According to the invention, an elastic interconnect device having an elastic substrate and an elastic, fanned-out contact structure with contact surfaces comprised of conductor lines is generated first. Then, electronic components are mounted on the interconnect device. Finally, the interconnect device is encapsulated. If a freeform surface with an electronic system is to be generated, the electronic system produced in this way is then mounted on the previously provided freeform surface.
    Type: Grant
    Filed: June 29, 2010
    Date of Patent: October 14, 2014
    Assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
    Inventors: Thomas Löher, Andreas Ostmann, Manuel Seckel
  • Patent number: 8654536
    Abstract: The present invention relates to a method for the production of an expandable circuit carrier in which a starting material for an expandable substrate is applied on an electrically conductive foil which forms an expandable substrate layer which is connected to the foil, after which the foil is structured such that it forms a conductor structure having at least one expandable strip conductor. The present invention further relates to an expandable circuit carrier which can be produced by the method.
    Type: Grant
    Filed: November 15, 2007
    Date of Patent: February 18, 2014
    Assignee: Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
    Inventors: Andreas Ostmann, Manuel Seckel, Thomas Löher, Dionysios Manessis, Rainer Patzelt
  • Publication number: 20120176764
    Abstract: The invention relates to a method for generating an electronic system for application to freeform surfaces, a method for producing freeform surfaces having an electronic system, and an electronic system and a combination of a freeform surface having at least one such system. According to the invention, an elastic interconnect device having an elastic substrate and an elastic, fanned-out contact structure with contact surfaces comprised of conductor lines is generated first. Then, electronic components are mounted on the interconnect device. Finally, the interconnect device is encapsulated. If a freeform surface with an electronic system is to be generated, the electronic system produced in this way is then mounted on the previously provided freeform surface.
    Type: Application
    Filed: June 29, 2010
    Publication date: July 12, 2012
    Applicant: Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung E.V.
    Inventors: Thomas Löher, Andreas Ostmann, Manuel Seckel
  • Publication number: 20080257589
    Abstract: The present invention relates to a method for the production of an expandable circuit carrier in which a starting material for an expandable substrate is applied on an electrically conductive foil which forms an expandable substrate layer which is connected to the foil, after which the foil is structured such that it forms a conductor structure having at least one expandable strip conductor. The present invention further relates to an expandable circuit carrier which can be produced by the method.
    Type: Application
    Filed: November 15, 2007
    Publication date: October 23, 2008
    Inventors: Andreas Ostmann, Manuel Seckel, Thomas Loher, Dionysios Manessis, Rainer Patzelt