Patents by Inventor Manuj Nahar
Manuj Nahar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20210265466Abstract: A method of forming a semiconductor structure includes forming a first material over a base material by vapor phase epitaxy. The first material has a crystalline portion and an amorphous portion. The amorphous portion of the first material is removed by abrasive planarization. At least a second material is formed by vapor phase epitaxy over the crystalline portion of first material. The second material has a crystalline portion and an amorphous portion. The amorphous portion of the second material is removed by abrasive planarization. A semiconductor structure formed by such a method includes the substrate, the first material, the second material, and optionally, an oxide material between the first material and the second material. The substrate, the first material, and the second material define a continuous crystalline structure. Semiconductor structures, memory devices, and systems are also disclosed.Type: ApplicationFiled: May 13, 2021Publication date: August 26, 2021Inventors: Michael Mutch, Manuj Nahar
-
Publication number: 20210175357Abstract: A transistor comprises a top source/drain region, a bottom source/drain region, and a channel region vertically between the top and bottom source/drain regions. A gate is operatively laterally-adjacent the channel region. The top source/drain region, the bottom source/drain region, and the channel region respectively have crystal grains and grain boundaries between immediately-adjacent of the crystal grains. At least one of the bottom source/drain region and the channel region has an internal interface there-within between the crystal grains that are above the internal interface and the crystal grains that are below the internal interface. At least some of the crystal grains that are immediately-above the internal interface physically contact at least some of the crystal grains that are immediately-below the internal interface.Type: ApplicationFiled: January 27, 2021Publication date: June 10, 2021Applicant: Micron Technology, Inc.Inventors: Manuj Nahar, Michael Mutch
-
Publication number: 20210175013Abstract: A method used in forming an electronic device comprising conductive material and ferroelectric material comprises forming a composite stack comprising multiple metal oxide-comprising insulator materials. At least one of the metal oxide-comprising insulator materials is between and directly against non-ferroelectric insulating materials. The multiple metal oxide-comprising insulator materials are of different composition from that of immediately-adjacent of the non-ferroelectric insulating materials. The composite stack is subjected to a temperature of at least 200° C. After the subjecting, the composite stack comprises multiple ferroelectric metal oxide-comprising insulator materials at least one of which is between and directly against non-ferroelectric insulating materials. After the subjecting, the composite stack is ferroelectric. Conductive material is formed and that is adjacent the composite stack. Devices are also disclosed.Type: ApplicationFiled: February 23, 2021Publication date: June 10, 2021Applicant: Micron Technology, Inc.Inventors: Manuj Nahar, Ashonita A. Chavan
-
Patent number: 11018229Abstract: A method of forming a semiconductor structure includes forming a first material over a base material by vapor phase epitaxy. The first material has a crystalline portion and an amorphous portion. The amorphous portion of the first material is removed by abrasive planarization. At least a second material is formed by vapor phase epitaxy over the crystalline portion of first material. The second material has a crystalline portion and an amorphous portion. The amorphous portion of the second material is removed by abrasive planarization. A semiconductor structure formed by such a method includes the substrate, the first material, the second material, and optionally, an oxide material between the first material and the second material. The substrate, the first material, and the second material define a continuous crystalline structure. Semiconductor structures, memory devices, and systems are also disclosed.Type: GrantFiled: September 5, 2018Date of Patent: May 25, 2021Assignee: Micron Technology, Inc.Inventors: Michael Mutch, Manuj Nahar
-
Patent number: 10964811Abstract: A transistor comprises a top source/drain region, a bottom source/drain region, and a channel region vertically between the top and bottom source/drain regions. A gate is operatively laterally-adjacent the channel region. The top source/drain region, the bottom source/drain region, and the channel region respectively have crystal grains and grain boundaries between immediately-adjacent of the crystal grains. At least one of the bottom source/drain region and the channel region has an internal interface there-within between the crystal grains that are above the internal interface and the crystal grains that are below the internal interface. At least some of the crystal grains that are immediately-above the internal interface physically contact at least some of the crystal grains that are immediately-below the internal interface.Type: GrantFiled: August 9, 2019Date of Patent: March 30, 2021Assignee: Micron Technology, Inc.Inventors: Manuj Nahar, Michael Mutch
-
Patent number: 10950384Abstract: A method used in forming an electronic device comprising conductive material and ferroelectric material comprises forming a composite stack comprising multiple metal oxide-comprising insulator materials. At least one of the metal oxide-comprising insulator materials is between and directly against non-ferroelectric insulating materials. The multiple metal oxide-comprising insulator materials are of different composition from that of immediately-adjacent of the non-ferroelectric insulating materials. The composite stack is subjected to a temperature of at least 200° C. After the subjecting, the composite stack comprises multiple ferroelectric metal oxide-comprising insulator materials at least one of which is between and directly against non-ferroelectric insulating materials. After the subjecting, the composite stack is ferroelectric. Conductive material is formed and that is adjacent the composite stack. Devices are also disclosed.Type: GrantFiled: August 30, 2017Date of Patent: March 16, 2021Assignee: Micron Technology, Inc.Inventors: Manuj Nahar, Ashonita A. Chavan
-
Patent number: 10923593Abstract: A transistor comprises a top source/drain region, a bottom source/drain region, a channel region vertically between the top and bottom source/drain regions, and a gate operatively laterally-adjacent the channel region. An upper material is directly above a lower material. The upper material is in at least one of the top source/drain region, the bottom source/drain region, and the channel region. The lower material is in at least one of the top source/drain region, the bottom source/drain region, and the channel region. The upper material comprises 1 atomic percent to 10 atomic percent elemental-form H and 0 total atomic percent to less than 0.1 total atomic percent of one or more noble elements. The lower material comprises 0 atomic percent to less than 1 atomic percent elemental-form H and 0.1 total atomic percent to 10 total atomic percent of one or more noble elements. Other embodiments, including method, are disclosed.Type: GrantFiled: August 9, 2019Date of Patent: February 16, 2021Assignee: Micron Technology, Inc.Inventors: Manuj Nahar, Vassil N. Antonov, Darwin Franseda Fan, Ali Moballegh
-
Publication number: 20210043731Abstract: A transistor comprises a top source/drain region, a bottom source/drain region, a channel region vertically between the top and bottom source/drain regions, and a gate operatively laterally-adjacent the channel region. The channel region is crystalline and comprises a plurality of vertically-elongated crystal grains that individually are directly against both of the top source/drain region and the bottom source/drain region. Other embodiments, including methods, are disclosed.Type: ApplicationFiled: August 6, 2020Publication date: February 11, 2021Applicant: Micron Technology, Inc.Inventors: Manuj Nahar, Vassil N. Antonov, Kamal M. Karda, Michael Mutch, Hung-Wei Liu, Jeffery B. Hull
-
Publication number: 20210043767Abstract: A transistor comprises a top source/drain region, a bottom source/drain region, and a channel region vertically between the top and bottom source/drain regions. A gate is operatively laterally-adjacent the channel region. The top source/drain region, the bottom source/drain region, and the channel region respectively have crystal grains and grain boundaries between immediately-adjacent of the crystal grains. At least one of the bottom source/drain region and the channel region has an internal interface there-within between the crystal grains that are above the internal interface and the crystal grains that are below the internal interface. At least some of the crystal grains that are immediately-above the internal interface physically contact at least some of the crystal grains that are immediately-below the internal interface.Type: ApplicationFiled: August 9, 2019Publication date: February 11, 2021Applicant: Micron Technology, Inc.Inventors: Manuj Nahar, Michael Mutch
-
Publication number: 20210043768Abstract: A transistor comprises a top source/drain region, a bottom source/drain region, a channel region vertically between the top and bottom source/drain regions, and a gate operatively laterally-adjacent the channel region. An upper material is directly above a lower material. The upper material is in at least one of the top source/drain region, the bottom source/drain region, and the channel region. The lower material is in at least one of the top source/drain region, the bottom source/drain region, and the channel region. The upper material comprises 1 atomic percent to 10 atomic percent elemental-form H and 0 total atomic percent to less than 0.1 total atomic percent of one or more noble elements. The lower material comprises 0 atomic percent to less than 1 atomic percent elemental-form H and 0.1 total atomic percent to 10 total atomic percent of one or more noble elements. Other embodiments, including method, are disclosed.Type: ApplicationFiled: August 9, 2019Publication date: February 11, 2021Applicant: Micron Technology, Inc.Inventors: Manuj Nahar, Vassil N. Antonov, Darwin Franseda Fan, Ali Moballegh
-
Patent number: 10886130Abstract: Some embodiments include a method of forming crystalline semiconductor material. A template is provided to have a polycrystalline region along a surface. Semiconductor material is deposited along the surface under conditions which grow crystalline semiconductor structures from grains of the polycrystalline region. The deposition is conducted at a temperature of less than or equal to 500° C. Some embodiments include a method of forming a transistor. A template is provided to have a polycrystalline region along a surface. Semiconductor material is deposited along the surface under conditions which grow crystalline semiconductor structures from grains of the polycrystalline region. The semiconductor material includes germanium. The crystalline semiconductor structures are doped to form a configuration having a first portion over a second portion. Insulative material is formed adjacent the second portion. A transistor gate is formed along the insulative material.Type: GrantFiled: August 24, 2018Date of Patent: January 5, 2021Assignee: Micron Technology, Inc.Inventors: Manuj Nahar, Darwin Franseda Fan, Junting Liu-Norrod, Michael Mutch
-
Publication number: 20200373314Abstract: A method used in forming an electronic component comprising conductive material and ferroelectric material comprises forming a non-ferroelectric metal oxide-comprising insulator material over a substrate. A composite stack comprising at least two different composition non-ferroelectric metal oxides is formed over the substrate. The composite stack has an overall conductivity of at least 1×102 Siemens/cm. The composite stack is used to render the non-ferroelectric metal oxide-comprising insulator material to be ferroelectric. Conductive material is formed over the composite stack and the insulator material. Ferroelectric capacitors and ferroelectric field effect transistors independent of method of manufacture are also disclosed.Type: ApplicationFiled: August 10, 2020Publication date: November 26, 2020Applicant: Micron Technology, Inc.Inventors: Ashonita A. Chavan, Durai Vishak Nirmal Ramaswamy, Manuj Nahar
-
Publication number: 20200303493Abstract: A method includes forming a semiconductor structure. The structure includes a first material, a blocking material, a second material in an amorphous form, and a third material in an amorphous form. The blocking material is disposed between the first material and the second material. At least the second material and the third material each comprise silicon and/or germanium. The structure is exposed to a temperature above a crystallization temperature of the third material and below a crystallization temperature of the second material. Semiconductor structures, memory devices, and systems are also disclosed.Type: ApplicationFiled: June 10, 2020Publication date: September 24, 2020Inventors: Michael Mutch, Manuj Nahar, Wayne I. Kinney
-
Patent number: 10748914Abstract: A method used in forming an electronic component comprising conductive material and ferroelectric material comprises forming a non-ferroelectric metal oxide-comprising insulator material over a substrate. A composite stack comprising at least two different composition non-ferroelectric metal oxides is formed over the substrate. The composite stack has an overall conductivity of at least 1×102 Siemens/cm. The composite stack is used to render the non-ferroelectric metal oxide-comprising insulator material to be ferroelectric. Conductive material is formed over the composite stack and the insulator material. Ferroelectric capacitors and ferroelectric field effect transistors independent of method of manufacture are also disclosed.Type: GrantFiled: December 13, 2017Date of Patent: August 18, 2020Assignee: Micron Technology, Inc.Inventors: Ashonita A. Chavan, Durai Vishak Nirmal Ramaswamy, Manuj Nahar
-
Publication number: 20200243267Abstract: Some embodiments include an apparatus having horizontally-spaced bottom electrodes supported by a supporting structure. Leaker device material is directly against the bottom electrodes. Insulative material is over the bottom electrodes, and upper electrodes are over the insulative material. Plate material extends across the upper electrodes and couples the upper electrodes to one another. The plate material is directly against the leaker device material. The leaker device material electrically couples the bottom electrodes to the plate material, and may be configured to discharge at least a portion of excess charge from the bottom electrodes to the plate material. Some embodiments include methods of forming apparatuses which include capacitors having bottom electrodes and top electrodes, with the top electrodes being electrically coupled to one another through a conductive plate. Leaker devices are formed to electrically couple the bottom electrodes to the conductive plate.Type: ApplicationFiled: April 17, 2020Publication date: July 30, 2020Applicant: Micron Technology, Inc.Inventors: Ashonita A. Chavan, Beth R. Cook, Manuj Nahar, Durai Vishak Nirmal Ramaswamy
-
Patent number: 10707298Abstract: A method includes forming a semiconductor structure. The structure includes a first material, a blocking material, a second material in an amorphous form, and a third material in an amorphous form. The blocking material is disposed between the first material and the second material. At least the second material and the third material each comprise silicon and/or germanium. The structure is exposed to a temperature above a crystallization temperature of the third material and below a crystallization temperature of the second material. Semiconductor structures, memory devices, and systems are also disclosed.Type: GrantFiled: September 5, 2018Date of Patent: July 7, 2020Assignee: Micron Technology, Inc.Inventors: Michael Mutch, Manuj Nahar, Wayne I. Kinney
-
Patent number: 10650978Abstract: Some embodiments include an apparatus having horizontally-spaced bottom electrodes supported by a supporting structure. Leaker device material is directly against the bottom electrodes. Insulative material is over the bottom electrodes, and upper electrodes are over the insulative material. Plate material extends across the upper electrodes and couples the upper electrodes to one another. The plate material is directly against the leaker device material. The leaker device material electrically couples the bottom electrodes to the plate material, and may be configured to discharge at least a portion of excess charge from the bottom electrodes to the plate material. Some embodiments include methods of forming apparatuses which include capacitors having bottom electrodes and top electrodes, with the top electrodes being electrically coupled to one another through a conductive plate. Leaker devices are formed to electrically couple the bottom electrodes to the conductive plate.Type: GrantFiled: December 15, 2017Date of Patent: May 12, 2020Assignee: Micron Technology, Inc.Inventors: Ashonita A. Chavan, Beth R. Cook, Manuj Nahar, Durai Vishak Nirmal Ramaswamy
-
Publication number: 20200075713Abstract: A method includes forming a semiconductor structure. The structure includes a first material, a blocking material, a second material in an amorphous form, and a third material in an amorphous form. The blocking material is disposed between the first material and the second material. At least the second material and the third material each comprise silicon and/or germanium. The structure is exposed to a temperature above a crystallization temperature of the third material and below a crystallization temperature of the second material. Semiconductor structures, memory devices, and systems are also disclosed.Type: ApplicationFiled: September 5, 2018Publication date: March 5, 2020Inventors: Michael Mutch, Manuj Nahar, Wayne I. Kinney
-
Publication number: 20200075732Abstract: A method of forming a semiconductor structure includes forming a first material over a base material by vapor phase epitaxy. The first material has a crystalline portion and an amorphous portion. The amorphous portion of the first material is removed by abrasive planarization. At least a second material is formed by vapor phase epitaxy over the crystalline portion of first material. The second material has a crystalline portion and an amorphous portion. The amorphous portion of the second material is removed by abrasive planarization. A semiconductor structure formed by such a method includes the substrate, the first material, the second material, and optionally, an oxide material between the first material and the second material. The substrate, the first material, and the second material define a continuous crystalline structure. Semiconductor structures, memory devices, and systems are also disclosed.Type: ApplicationFiled: September 5, 2018Publication date: March 5, 2020Inventors: Michael Mutch, Manuj Nahar
-
Publication number: 20200066513Abstract: Some embodiments include a method of forming crystalline semiconductor material. A template is provided to have a polycrystalline region along a surface. Semiconductor material is deposited along the surface under conditions which grow crystalline semiconductor structures from grains of the polycrystalline region. The deposition is conducted at a temperature of less than or equal to 500° C. Some embodiments include a method of forming a transistor. A template is provided to have a polycrystalline region along a surface. Semiconductor material is deposited along the surface under conditions which grow crystalline semiconductor structures from grains of the polycrystalline region. The semiconductor material includes germanium. The crystalline semiconductor structures are doped to form a configuration having a first portion over a second portion. Insulative material is formed adjacent the second portion. A transistor gate is formed along the insulative material.Type: ApplicationFiled: August 24, 2018Publication date: February 27, 2020Applicant: Micron Technology, Inc.Inventors: Manuj Nahar, Darwin Franseda Fan, Junting Liu-Norrod, Michael Mutch