Abstract: A semiconductor package structure includes a package substrate, an encapsulant, at least one passage and at least one semiconductor element. The encapsulant is disposed on the package substrate and has a peripheral surface, and includes a first encapsulant portion and a second encapsulant portion spaced apart from the first encapsulant portion. The at least one passage is defined by the first encapsulant portion and the second encapsulant portion, and the passage has at least one opening in the peripheral surface of the encapsulant. The at least one semiconductor element is disposed on the package substrate and exposed in the passage.

Abstract: A semiconductor package structure includes a package substrate, an encapsulant, at least one passage and at least one semiconductor element. The encapsulant is disposed on the package substrate and has a peripheral surface, and includes a first encapsulant portion and a second encapsulant portion spaced apart from the first encapsulant portion. The at least one passage is defined by the first encapsulant portion and the second encapsulant portion, and the passage has at least one opening in the peripheral surface of the encapsulant. The at least one semiconductor element is disposed on the package substrate and exposed in the passage.

Abstract: An LED lamp includes a lamp base, a heat-dissipating unit, a reflecting unit, a board, and at least one LED mounted on one side of the board facing toward the lamp base. The heat-dissipating unit includes a plurality of heat-dissipating fins disposed spacedly along a periphery of the lamp base. The reflecting unit has a reflector portion and is connected in a thermal-conducting manner to a side of the heat-dissipating fins opposite to the lamp base. The board is connected to the reflecting unit in a manner that the board is spaced apart from the reflector portion, and is formed with at least one light-transmissive portion. The LED has a light exit side facing toward the reflector portion. Light emitted by the LED is reflected by the reflector portion and exits the LED lamp via the light-transmissive portion of the board.

Abstract: A heat dissipating device includes a tubular body having a first open end, and a plurality of heat dissipating fins, each having a fin body and a first engaging portion formed on the fin body for engaging the first open end of the tubular body in a manner that the heat dissipating fins are disposed to radiate from and to surround the tubular body. The first engaging portion includes a first extension section bent from the fin body, and a first hook extending from the first extension section for hooking onto the tubular body at the first open end.

Abstract: A reflective LED lamp includes a metallic shell, a reflecting member, and an LED unit. The metallic shell includes a surrounding wall formed with a mounting hole unit, and an accommodating space defined by the surrounding wall. The reflecting member is disposed within the accommodating space, and includes a reflection region unit configured as at least one concaved curve surface. The LED unit is disposed within the mounting hole unit in the shell for emitting light onto the reflection region unit of the reflecting member, so that the light is reflected by the reflection region unit out of the shell.

Abstract: A multi-socket solar energy converting battery charger for mobile phone that is easily portable and capable of converting sunlight to electricity to charge the mobile phone. The battery charger comprises a case part and a over part that respectively mount solar panels. The battery charger further includes a circuit board that has a protection circuit, particular circuits, and a voltage stabilizing circuit to stabilize the charging voltage. The circuit board is further connected to a socket through which the battery charger connects a converter socket block to accommodate different types of mobile phones.