Patents by Inventor Marat GERSHOIG

Marat GERSHOIG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240133951
    Abstract: In one embodiment, a device comprises: a first die having disposed thereon a first plurality of latches wherein ones of the first plurality of latches are operatively connected to an adjacent one of the first plurality of latches; and a second die having disposed thereon a second plurality of latches wherein ones of the second plurality of latches are operatively connected to an adjacent one of the second plurality of latches. Each latch of the first plurality of latches on said first die corresponds to a latch in the second plurality of latches on said second die. Each set of corresponding latches are operatively connected. A scan path comprises a closed loop comprising each of said first and second plurality of latches. One of the second plurality of latches is operatively connected to another one of the second plurality of latches via an inverter.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Inventors: Sandeep Kumar GOEL, Yun-Han LEE, Saman M.I. ADHAM, Marat GERSHOIG
  • Publication number: 20240055066
    Abstract: Performing a built-in self-test (BIST) on a memory macro includes generating a plurality of input vectors such that at least one input vector of the plurality of input vectors is transmitted to the memory macro in each of a plurality of cycles, receiving in each of the plurality of cycles, an output data from the memory macro. The output data is generated by the memory macro in response to processing the at least one input vector. The BIST also includes comparing the output data in each of the plurality of cycles with a signature value and determining whether the memory macro is normal or faulty based upon the comparison.
    Type: Application
    Filed: October 13, 2023
    Publication date: February 15, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ted Wong, Saman Adham, Marat Gershoig, Vineet Joshi
  • Patent number: 11899064
    Abstract: In one embodiment, a device comprises: a first die having disposed thereon a first plurality of latches wherein ones of the first plurality of latches are operatively connected to an adjacent one of the first plurality of latches; and a second die having disposed thereon a second plurality of latches wherein ones of the second plurality of latches are operatively connected to an adjacent one of the second plurality of latches. Each latch of the first plurality of latches on said first die corresponds to a latch in the second plurality of latches on said second die. Each set of corresponding latches are operatively connected. A scan path comprises a closed loop comprising each of said first and second plurality of latches. One of the second plurality of latches is operatively connected to another one of the second plurality of latches via an inverter.
    Type: Grant
    Filed: December 13, 2022
    Date of Patent: February 13, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sandeep Kumar Goel, Yun-Han Lee, Saman M. I. Adham, Marat Gershoig
  • Patent number: 11823758
    Abstract: Performing a built-in self-test (BIST) on a memory macro includes generating a plurality of input vectors such that at least one input vector of the plurality of input vectors is transmitted to the memory macro in each of a plurality of cycles, receiving in each of the plurality of cycles, an output data from the memory macro. The output data is generated by the memory macro in response to processing the at least one input vector. The BIST also includes comparing the output data in each of the plurality of cycles with a signature value and determining whether the memory macro is normal or faulty based upon the comparison.
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: November 21, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Saman Adham, Ted Wong, Marat Gershoig, Vineet Joshi
  • Publication number: 20230113905
    Abstract: In one embodiment, a device comprises: a first die having disposed thereon a first plurality of latches wherein ones of the first plurality of latches are operatively connected to an adjacent one of the first plurality of latches; and a second die having disposed thereon a second plurality of latches wherein ones of the second plurality of latches are operatively connected to an adjacent one of the second plurality of latches. Each latch of the first plurality of latches on said first die corresponds to a latch in the second plurality of latches on said second die. Each set of corresponding latches are operatively connected. A scan path comprises a closed loop comprising each of said first and second plurality of latches. One of the second plurality of latches is operatively connected to another one of the second plurality of latches via an inverter.
    Type: Application
    Filed: December 13, 2022
    Publication date: April 13, 2023
    Inventors: Sandeep Kumar GOEL, Yun-Han LEE, Saman M.I. ADHAM, Marat GERSHOIG
  • Patent number: 11549984
    Abstract: In one embodiment, a device comprises: a first die having disposed thereon a first plurality of latches wherein ones of the first plurality of latches are operatively connected to an adjacent one of the first plurality of latches; and a second die having disposed thereon a second plurality of latches wherein ones of the second plurality of latches are operatively connected to an adjacent one of the second plurality of latches. Each latch of the first plurality of latches on said first die corresponds to a latch in the second plurality of latches on said second die. Each set of corresponding latches are operatively connected. A scan path comprises a closed loop comprising each of said first and second plurality of latches. One of the second plurality of latches is operatively connected to another one of the second plurality of latches via an inverter.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: January 10, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sandeep Kumar Goel, Yun-Han Lee, Saman M. I. Adham, Marat Gershoig
  • Publication number: 20220254429
    Abstract: Performing a built-in self-test (BIST) on a memory macro includes generating a plurality of input vectors. One input vector is transmitted to the memory macro in each of a plurality of cycles. Each of the plurality of input vectors is associated with a bit width. Generating the input vector includes generating a partial input vector of half the bit width and transmitting the partial input vector to each of a first half of the memory macro and a second half of the memory macro. The method also includes receiving, in each of the plurality of cycles, an output data from the memory macro, such that the output data is generated by the memory macro in response to processing the partial input vector, comparing the output data with a signature value, and determining whether the memory macro is normal or faulty based upon the comparison.
    Type: Application
    Filed: September 9, 2021
    Publication date: August 11, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ted Wong, Saman Adham, Marat Gershoig
  • Publication number: 20220254428
    Abstract: Performing a built-in self-test (BIST) on a memory macro includes generating a plurality of input vectors such that at least one input vector of the plurality of input vectors is transmitted to the memory macro in each of a plurality of cycles, receiving in each of the plurality of cycles, an output data from the memory macro. The output data is generated by the memory macro in response to processing the at least one input vector. The BIST also includes comparing the output data in each of the plurality of cycles with a signature value and determining whether the memory macro is normal or faulty based upon the comparison.
    Type: Application
    Filed: September 9, 2021
    Publication date: August 11, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Saman Adham, Ted Wong, Marat Gershoig, Vineet Joshi
  • Publication number: 20200124668
    Abstract: In one embodiment, a device comprises: a first die having disposed thereon a first plurality of latches wherein ones of the first plurality of latches are operatively connected to an adjacent one of the first plurality of latches; and a second die having disposed thereon a second plurality of latches wherein ones of the second plurality of latches are operatively connected to an adjacent one of the second plurality of latches. Each latch of the first plurality of latches on said first die corresponds to a latch in the second plurality of latches on said second die. Each set of corresponding latches are operatively connected. A scan path comprises a closed loop comprising each of said first and second plurality of latches. One of the second plurality of latches is operatively connected to another one of the second plurality of latches via an inverter.
    Type: Application
    Filed: December 23, 2019
    Publication date: April 23, 2020
    Inventors: Sandeep Kumar GOEL, Yun-Han LEE, Saman M.I ADHAM, Marat GERSHOIG
  • Patent number: 10539617
    Abstract: A device comprises a first die; and a second die stacked below the first die with interconnections between the first die and the second die. A least one of the first die or the second die has a circuit for performing a function and provides a functional path. Each of the first and second dies comprise a plurality of latches, including a respective latch corresponding to each one of the interconnections; and a plurality of multiplexers. Each multiplexer is connected to a respective one of the plurality of latches and arranged for receiving and selecting one of a scan test pattern or a signal from the functional path for outputting during a scan chain test of the first die and second die.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: January 21, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sandeep Kumar Goel, Yun-Han Lee, Saman M. I. Adham, Marat Gershoig
  • Publication number: 20170350939
    Abstract: A device comprises a first die; and a second die stacked below the first die with interconnections between the first die and the second die. A least one of the first die or the second die has a circuit for performing a function and provides a functional path. Each of the first and second dies comprise a plurality of latches, including a respective latch corresponding to each one of the interconnections; and a plurality of multiplexers. Each multiplexer is connected to a respective one of the plurality of latches and arranged for receiving and selecting one of a scan test pattern or a signal from the functional path for outputting during a scan chain test of the first die and second die.
    Type: Application
    Filed: June 2, 2016
    Publication date: December 7, 2017
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Sandeep Kumar GOEL, Yun-Han LEE, Saman M.I. ADHAM, Marat GERSHOIG