Abstract: An underwater propulsion device is disclosed comprising two sleeves for fitting around each of a user's lower legs, with each sleeve mounting a propulsion unit, and the sleeves being connectable by a bar between them during underwater operation of the device by the user.

Abstract: The present disclosure provides energy control systems for whole home and partial home backup with integrated breaker spaces and metering. The energy control system includes a grid interconnection electrically coupled to a utility grid, a backup power interconnection electrically coupled to a backup power source, a backup load interconnection electrically coupled to at least one backup load, and a non-backup load interconnection electrically coupled to at least one non-backup load. The energy control system includes a microgrid interconnection device that switches between an on-grid mode to electrically connect the grid interconnection and the backup power interconnection with the backup and non-backup load interconnections and a backup mode to electrically disconnect the grid interconnection and the non-backup load interconnection from the backup power interconnection.

Abstract: The present disclosure provides a method for controlling an energy control system. The energy control system includes a grid interconnection, a backup load interconnection, a non-backup load interconnection, and a backup power interconnection. The method includes receiving electronic data from a plurality of backup loads. The method includes detecting a power outage at the grid interconnection electrically coupled to a utility grid. The method includes disconnecting the grid interconnection from the backup power interconnection, in which the backup power interconnection is electrically coupled to a backup power source. The method includes connecting a first set of the plurality of backup loads to the backup load interconnection, in which the backup load interconnection is electrically coupled to the backup power interconnection such that power is supplied from the backup power source to the first set of backup loads.

Abstract: Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.

Abstract: Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.

Abstract: The present disclosure provides energy control systems for whole home and partial home backup with integrated breaker spaces and metering. The energy control system includes a grid interconnection electrically coupled to a utility grid, a backup power interconnection electrically coupled to a backup power source, a backup load interconnection electrically coupled to at least one backup load, and a non-backup load interconnection electrically coupled to at least one non-backup load. The energy control system includes a microgrid interconnection device that switches between an on-grid mode to electrically connect the grid interconnection and the backup power interconnection with the backup and non-backup load interconnections and a backup mode to electrically disconnect the grid interconnection and the non-backup load interconnection from the backup power interconnection.

Abstract: Strings of solar cells having laser assisted metallization conductive contact structures, and their methods of manufacture, are described. For example, a solar cell string includes a first solar cell having a front side and a back side, and one or more laser assisted metallization conductive contact structures electrically connecting a first metal foil to the back side of the first solar cell. The solar cell string also includes a second solar cell having a front side and a back side, and one or more laser assisted metallization conductive contact structures electrically connecting a second metal foil to the back side of the second solar cell. The solar cell string also includes a conductive interconnect coupling the first and second solar cells, the conductive interconnect including a strain relief feature.

Abstract: The present disclosure provides energy control systems for whole home and partial home backup with integrated breaker spaces and metering. The energy control system includes a grid interconnection electrically coupled to a utility grid, a backup power interconnection electrically coupled to a backup power source, a backup load interconnection electrically coupled to at least one backup load, and a non-backup load interconnection electrically coupled to at least one non-backup load. The energy control system includes a microgrid interconnection device that switches between an on-grid mode to electrically connect the grid interconnection and the backup power interconnection with the backup and non-backup load interconnections and a backup mode to electrically disconnect the grid interconnection and the non-backup load interconnection from the backup power interconnection.

Abstract: The present disclosure provides energy control systems for whole home and partial home backup with integrated breaker spaces and metering. The energy control system includes a grid interconnection electrically coupled to a utility grid, a backup power interconnection electrically coupled to a backup power source, a backup load interconnection electrically coupled to at least one backup load, and a non-backup load interconnection electrically coupled to at least one non-backup load. The energy control system includes a microgrid interconnection device that switches between an on-grid mode to electrically connect the grid interconnection and the backup power interconnection with the backup and non-backup load interconnections and a backup mode to electrically disconnect the grid interconnection and the non-backup load interconnection from the backup power interconnection.

Abstract: The present disclosure provides a method for controlling an energy control system. The energy control system includes a grid interconnection, a backup load interconnection, a non-backup load interconnection, and a backup power interconnection. The method includes receiving electronic data from a plurality of backup loads. The method includes detecting a power outage at the grid interconnection electrically coupled to a utility grid. The method includes disconnecting the grid interconnection from the backup power interconnection, in which the backup power interconnection is electrically coupled to a backup power source. The method includes connecting a first set of the plurality of backup loads to the backup load interconnection, in which the backup load interconnection is electrically coupled to the backup power interconnection such that power is supplied from the backup power source to the first set of backup loads.

Abstract: Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.

Abstract: A sterile drape for a C-arm X-ray device includes a slide rail assembly configured to be connected to a C-arm of an X-ray device that extends from a lower portion of the C-arm to an upper portion of the C-arm. The sterile drape further comprises a sterile drape assembly comprising a length of compliant material, the sterile drape assembly configured to be detachably coupled to the upper portion of the C-arm and to the slide rail assembly. The sterile drape also comprises an anchor assembly configured to be connected to the C-arm X-ray device at one end and configured to be connected to the sterile drape assembly at the other end so that the anchor assembly draws the sterile drape assembly along the slide rail assembly as the C-arm is rotated.

Abstract: Sterile drapes for C-arm X-ray devices that allow users to easily maintain sterility in a surgical field as the C-arm is rotated or moved around a patient are described. The sterile drape contains a slide rail assembly configured to be connected to a C-arm of an X-ray device that extends from a lower portion of the C-arm to an upper portion of the C-arm, a sterile drape assembly comprising a length of compliant material, the sterile drape assembly configured to be detachably coupled to the upper portion of the C-arm and to the slide rail assembly, and an anchor assembly configured to be connected to the X-ray device at one end and configured to be connected to the sterile drape assembly at the other end so that the anchor assembly draws the sterile drape assembly along the slide rail assembly as the C-arm is rotated. The sterile drape is connected to the X-ray device so that one end of the sterile drape assembly remains in substantially the same position regardless of the movement of the C-arm.

Abstract: There is disclosed a garment closure comprising a front component, a rear component and an intermediate connector component. The connector component fastens the front component and the rear component together so that the front component and rear component are in spaced relationship relative to each other. The rear component is configured for insertion through a fastener aperture.

Abstract: There is disclosed a garment closure comprising a front component, a rear component and an intermediate connector component. The connector component fastens the front component and the rear component together so that the front component and rear component are in spaced relationship relative to each other. The rear component is configured for insertion through a fastener aperture.

Abstract: Semiconductor die are typically manufactured as a large group of integrated circuit die imaged through photolithographic means on a semiconductor wafer or slice made of silicon. After manufacture, the silicon wafer is thinned, usually by mechanical means, and the wafer is cut, usually with a diamond saw, to singulate the individual die. The resulting individual integrated circuit has six exposed surfaces. The top surface of the die includes the circuitry images and any passivation layers that have been added to the top layer during wafer fabrication. The present invention describes a method for protecting and insulating all six surfaces of the die to reduce breakage, provide electrical insulation for these layers, and to provide physical surfaces that can be used for bonding one semiconductor die to another for the purpose of stacking die in an interconnected module or component.

Abstract: Semiconductor die are typically manufactured as a large group of integrated circuit die imaged through photolithographic means on a semiconductor wafer or slice made of silicon. After manufacture, the silicon wafer is thinned, usually by mechanical means, and the wafer is cut, usually with a diamond saw, to singulate the individual die. The resulting individual integrated circuit has six exposed surfaces. The top surface of the die includes the circuitry images and any passivation layers that have been added to the top layer during wafer fabrication. The present invention describes a method for protecting and insulating all six surfaces of the die to reduce breakage, provide electrical insulation for these layers, and to provide physical surfaces that can be used for bonding one semiconductor die to another for the purpose of stacking die in an interconnected module or component.

Abstract: The present invention provides an apparatus for vertically interconnecting semiconductor die, integrated circuit die, or multiple die segments. Metal rerouting interconnects which extend to one or more sides of the die or segment can be optionally added to the die or multi die segment to provide edge bonding pads upon the surface of the die for external electrical connection points. After the metal rerouting interconnect has been added to the die on the wafer, the wafer is optionally thinned and each die or multiple die segment is singulated from the wafer by cutting or other appropriate singulation method. After the die or multiple die segments are singulated or cut from the wafer, insulation is applied to all surfaces of the die or multiple die segments, openings are made in the insulation above the desired electrical connection pads, and the die or multiple die segments are placed on top of one another to form a stack.

Abstract: The present invention provides an apparatus for vertically interconnecting semiconductor die, integrated circuit die, or multiple die segments. Metal rerouting interconnects which extend to one or more sides of the die or segment can be optionally added to the die or multi die segment to provide edge bonding pads upon the surface of the die for external electrical connection points. After the metal rerouting interconnect has been added to the die on the wafer, the wafer is optionally thinned and each die or multiple die segment is singulated from the wafer by cutting or other appropriate singulation method. After the die or multiple die segments are singulated or cut from the wafer, insulation is applied to all surfaces of the die or multiple die segments, openings are made in the insulation above the desired electrical connection pads, and the die or multiple die segments are placed on top of one another to form a stack.

Abstract: The present invention provides an apparatus for vertically interconnecting semiconductor die, integrated circuit die, or multiple die segments. Metal rerouting interconnects which extend to one or more sides of the die or segment can be optionally added to the die or multi die segment to provide edge bonding pads upon the surface of the die for external electrical connection points. After the metal rerouting interconnect has been added to the die on the wafer, the wafer is optionally thinned and each die or multiple die segment is singulated from the wafer by cutting or other appropriate singulation method. After the die or multiple die segments are singulated or cut from the wafer, insulation is applied to all surfaces of the die or multiple die segments, openings are made in the insulation above the desired electrical connection pads, and the die or multiple die segments are placed on top of one another to form a stack.