Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

Abstract: An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

Abstract: Apparatus, systems, and articles of manufacture are disclosed teaching an apparatus comprising an extender including a body and a tab, the tab coupled to the memory device, a first surface of the tab to be aligned with a second surface of the memory device. Examples disclosed herein further include a bracket to extend across the second surface of the memory device and the first surface of the tab, the bracket coupled to the first surface of the tab via fasteners.

Abstract: An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

Abstract: In one embodiment, a circuit board includes: a plurality of layers including interconnects to carry processor-to-processor signaling between a first processor and a second processor; a first connector adapted to a first peripheral portion of the circuit board to couple to a first contact member of the first processor; and a second connector adapted to a second peripheral portion of the circuit board to couple to a first contact member of the second processor. Other embodiments are described and claimed.

Abstract: A seat suspension system includes a vibration dampener adapted to operate over less than the full range over which a seat may be raised and lowered by a seat height adjuster, such as an air spring. The dampener may apply dampening forces which vary non-linearly, depending upon the extent a seat moves as a result of seat vibration. In several specific forms, the dampening mechanism is unlatched to permit relative movement of the seat and seat support mechanism relative to the dampener during seat height adjustment, with the dampener being relatched to again apply a dampening force. A mechanically simply seat leveling system may be employed to return the seat to a desired elevation in the event loading on the seat is varied, for example if a seat occupant gets up off a seat.

Abstract: A vibration damper module is described with a first member adapted for coupling to one of the vehicle and seat, and a shock absorber adapted to be coupled to the other of the vehicle and seat. The first member may take the form of a housing within which the shock absorber is substantially disposed. A latch selectively couples and decouples the housing to the shock absorber to respectively apply and relieve the application of the dampening force from the shock absorber to the seat which dampens vibrations in the seat. The shock absorber may include an external housing carrying a latch gripping surface, such as a plurality of teeth. The latch may comprise at least one latch arm having a latch surface. The latch arm may be shifted to a first position in which the latch surface and latch gripping surface are engaged to couple the first member to the shock absorber and to a second position wherein these components are disengaged.

Abstract: A vibration damper for a seat suspension system is disclosed with a shock absorber which dampens seat vibrations when the shock absorber is coupled to the seat suspension system. The shock absorber includes a dampening cylinder housing with a dampening piston slidable therein. The dampening cylinder housing is coupled to one of the vehicle and seat, such as to the floor of the vehicle. An elongated latch engaging member, which may be in the form of a dampening piston rod is coupled to the dampening piston. A latch is shiftable between first and second positions. When in the first position the latch engages the dampening rod, and when in the second position the latch disengages the dampening rod. When engaged to the dampening rod, the latch couples the dampening rod to the other of the vehicle and seat so that the shock absorber applies a dampening force to the seat. Conversely, when the latch disengages the dampening rod, the shock absorber is relieved from applying a dampening force to the seat.