Abstract: The invention relates to a method for producing a sensor. In the method, a sensor element having an IC is pre-overmolded to produce a preform, wherein the preform is designed in such a way that the preform can accommodate electrical contacts for the sensor having various dimensions and/or in various positions by press fitting. The electrical contacts are pressed into holes/recesses of the preform, the connections of the IC of the sensor are connected to the electrical contacts, and the preform is inserted into an injecting mold and is overmolded to produce the finished sensor. In this way, sensors for different applications can be produced in a substantially standardized manner. The invention further relates to a sensor.

Abstract: The invention relates to a method for producing a sensor. In the method, a sensor element having an IC is pre-overmolded to produce a preform, wherein the preform is designed in such a way that the preform can accommodate electrical contacts for the sensor having various dimensions and/or in various positions by press fitting. The electrical contacts are pressed into holes/recesses of the preform, the connections of the IC of the sensor are connected to the electrical contacts, and the preform is inserted into an injecting mold and is overmolded to produce the finished sensor. In this way, sensors for different applications can be produced in a substantially standardized manner. The invention further relates to a sensor.

Abstract: The present invention discloses a sensor and a method of its manufacture. The sensor is used to sense position shifts, motional velocities or rotational speeds of an encoder and comprises a housing which accommodates electric components. The housing is made up of a first housing part of plastics which is at least in part enwrapped by a second injection-molded housing part that is also made of plastics. The first housing part is designed integrally with at least one positioning element molecularly interfaced with the second housing part.