Patents by Inventor Marcelis Bout

Marcelis Bout has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Through-wafer via device and method of manufacturing the same
    Patent number: 9230908
    Abstract: The present invention relates to a through-wafer via device (10) comprising a wafer (12) made of a wafer material and having a first wafer surface (12a) and a second wafer surface (12b) opposing the first wafer surface (12a). The through-wafer via device (10) further comprises a plurality of side by side first trenches (14) provided with a conductive material and extending from the first wafer surface (12a) into the wafer (12) such that a plurality of spacers (16) of the wafer material are formed between the first trenches (14). The through-wafer via device (10) further comprises a second trench (18) provided with the conductive material and extending from the second wafer surface (12b) into the wafer (12), the second trench (18) being connected to the first trenches (14).
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: January 5, 2016
    Assignee: Koninklijke Philips N.V.
    Inventors: Ronald Dekker, Marcelis Bout, Marcel Mulder, Ruediger Mauczok
  • THROUGH-WAFER VIA DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140293751
    Abstract: The present invention relates to a through-wafer via device (10) comprising a wafer (12) made of a wafer material and having a first wafer surface (12a) and a second wafer surface (12b) opposing the first wafer surface (12a). The through-wafer via device (10) further comprises a plurality of side by side first trenches (14) provided with a conductive material and extending from the first wafer surface (12a) into the wafer (12) such that a plurality of spacers (16) of the wafer material are formed between the first trenches (14). The through-wafer via device (10) further comprises a second trench (18) provided with the conductive material and extending from the second wafer surface (12b) into the wafer (12), the second trench (18) being connected to the first trenches (14).
    Type: Application
    Filed: October 12, 2012
    Publication date: October 2, 2014
    Inventors: Ronald Dekker, Marcelis Bout, Marcel Mulder, Ruediger Mauczok