Patents by Inventor Marcelo S. Gonzales

Marcelo S. Gonzales has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6753613
    Abstract: A microelectronic package including a first microelectronic die and a second microelectronic die with a plurality of standoffs extending therebetween and an encapsulation material disposed between the first microelectronic die and the second microelectronic die, which extends between at least two the plurality of standoffs.
    Type: Grant
    Filed: March 13, 2002
    Date of Patent: June 22, 2004
    Assignee: Intel Corporation
    Inventors: Melvin N. Levardo, Marcelo S. Gonzales
  • Publication number: 20030173679
    Abstract: A microelectronic package including a first microelectronic die and a second microelectronic die with a plurality of standoffs extending therebetween and an encapsulation material disposed between the first microelectronic die and the second microelectronic die, which extends between at least two the plurality of standoffs.
    Type: Application
    Filed: March 13, 2002
    Publication date: September 18, 2003
    Inventors: Melvin N. Levardo, Marcelo S. Gonzales