Patents by Inventor Marco A. Acevedo

Marco A. Acevedo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked polishing pad having sealed edge
    Patent number: 6620036
    Abstract: A stacked polishing pad includes an upper polishing layer and a lower sub-layer having major faces which are in contact with each other. The polishing layer is substantially impermeable to liquid while the sub-layer is liquid absorbent. The sub-layer has an outer peripheral edge which is sealed to prevent absorption of liquid into the sub-layer through the outer peripheral edge. When the stacked polishing pad is mounted on a platen of a polishing machine, the sub-layer has no exposed surface which can absorb liquid.
    Type: Grant
    Filed: July 10, 2002
    Date of Patent: September 16, 2003
    Assignee: Rodel Holdings, INC
    Inventors: Peter W. Freeman, Marco A. Acevedo, Jon D. Jacobs, Jr.
  • Stacked polishing pad having sealed edge
    Publication number: 20020193059
    Abstract: A stacked polishing pad includes an upper polishing layer and a lower sub-layer having major faces which are in contact with each other. The polishing layer is substantially impermeable to liquid while the sub-layer is liquid absorbent. The sub-layer has an outer peripheral edge which is sealed to prevent absorption of liquid into the sub-layer through the outer peripheral edge. When the stacked polishing pad is mounted on a platen of a polishing machine, the sub-layer has no exposed surface which can absorb liquid.
    Type: Application
    Filed: July 10, 2002
    Publication date: December 19, 2002
    Inventors: Peter W. Freeman, Marco A. Acevedo, Jon D. Jacobs
  • Stacked polishing pad having sealed edge
    Patent number: 6464576
    Abstract: A stacked polishing pad includes an upper polishing layer and a lower sub-layer having major faces which are in contact with each other. The polishing layer is substantially impermeable to liquid while the sub-layer is liquid absorbent. The sub-layer has an outer peripheral edge which is sealed to prevent absorption of liquid into the sub-layer through the outer peripheral edge. When the stacked polishing pad is mounted on a platen of a polishing machine, the sub-layer has no exposed surface which can absorb liquid.
    Type: Grant
    Filed: August 10, 2000
    Date of Patent: October 15, 2002
    Assignee: Rodel Holdings Inc.
    Inventors: Peter W. Freeman, Marco A. Acevedo, Jon D. Jacobs, Jr.
  • Semiconductor polishing pad
    Publication number: 20020058468
    Abstract: A belt has a polishing pad with one or more polishing pad sections joined to the belt by an adhesive layer. A seam joint is reinforced with caulking material. Edge portions of the seam joint are beveled or dovetailed. Parallel stress relief grooves in the upper surface of the polishing pad prevent delamination of the polishing pad from the belt.
    Type: Application
    Filed: May 3, 2001
    Publication date: May 16, 2002
    Inventors: Stanley E. Eppert, Marco A. Acevedo, Peter W. Freeman, Tuyen Vo
  • Polishing pad
    Patent number: 6358130
    Abstract: A polishing pad for use with a polishing fluid has, a polishing layer, a window in an opening through the polishing layer, and a fluid impermeable layer spanning across the polishing layer and the window and the opening to provide an uninterrupted continuous barrier to leakage of polishing fluid, the fluid impermeable layer having thereon an adhesive forming bond seals with the polishing layer and the window.
    Type: Grant
    Filed: September 28, 2000
    Date of Patent: March 19, 2002
    Assignee: Rodel Holdings, Inc.
    Inventors: Peter W. Freeman, Stanley E. Eppert, Jr., Alan H. Saikin, Marco A. Acevedo