Patents by Inventor Marco HARYONO

Marco HARYONO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Azole silane compound
    Patent number: 11603378
    Abstract: The present invention relates to a specific azole silane compound, an oligomer thereof, a mixture comprising said compound and/or said oligomer, as well as a respective storage and working solution. Furthermore, the present invention relates to a synthesis method for said specific azole silane compound, and the use of said working solution as a surface treatment solution.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: March 14, 2023
    Assignee: Atotech Deutschland GmbH
    Inventors: Fabian Michalik, Stefanie Ackermann, Marco Haryono, Michael Merschky, Thomas Thomas, Markku Lager
  • AZOLE SILANE COMPOUND
    Publication number: 20210277034
    Abstract: The present invention relates to a specific azole silane compound, an oligomer thereof, a mixture comprising said compound and/or said oligomer, as well as a respective storage and working solution. Furthermore, the present invention relates to a synthesis method for said specific azole silane compound, and the use of said working solution as a surface treatment solution.
    Type: Application
    Filed: June 14, 2019
    Publication date: September 9, 2021
    Inventors: Fabian MICHALIK, Stefanie ACKERMANN, Marco HARYONO, Michael MERSCHKY, Thomas THOMAS, Markku LAGER
  • METHOD FOR DEPOSITING A COPPER SEED LAYER ONTO A BARRIER LAYER AND COPPER PLATING BATH
    Publication number: 20190024239
    Abstract: The present invention relates to an aqueous electroless copper plating bath, including a source for Cu(II) ions, glyoxylic acid as the reducing agent for Cu(II) ions, at least one complexing agent for Cu(II) ions and at least one source for hydroxide ions selected from the group consisting of RbOH, CsOH and mixtures thereof, wherein the electroless copper plating bath is substantially free of Na+, K+ and tetraalkylammonium ions.
    Type: Application
    Filed: September 13, 2018
    Publication date: January 24, 2019
    Inventors: Matthias DAMMASCH, Marco HARYONO, Sengül KARASAHIN, Hans-Jürgen SCHREIER
  • Method for depositing a copper seed layer onto a barrier layer and copper plating bath
    Patent number: 10077498
    Abstract: The present invention relates to a method for providing a copper seed layer on top of a barrier layer wherein said seed layer is deposited onto said barrier layer from an aqueous electroless copper plating bath comprising a water-soluble source for Cu(II) ions, a reducing agent for Cu(II) ions, at least one complexing agent for Cu(II) ions and at least one source for hydroxide ions selected from the group consisting of RbOH, CsOH and mixtures thereof. The resulting copper seed layer has a homogeneous thickness distribution and a smooth outer surface which are both desired properties.
    Type: Grant
    Filed: September 11, 2014
    Date of Patent: September 18, 2018
    Assignee: Atotech Deutschland GmbH
    Inventors: Matthias Dammasch, Marco Haryono, Sengül Karasahin, Hans-Jürgen Schreier
  • METHOD FOR DEPOSITING A COPPER SEED LAYER ONTO A BARRIER LAYER AND COPPER PLATING BATH
    Publication number: 20160194760
    Abstract: The present invention relates to a method for providing a copper seed layer on top of a barrier layer wherein said seed layer is deposited onto said barrier layer from an aqueous electroless copper plating bath comprising a water-soluble source for Cu(II) ions, a reducing agent for Cu(II) ions, at least one complexing agent for Cu(II) ions and at least one source for hydroxide ions selected from the group consisting of RbOH, CsOH and mixtures thereof. The resulting copper seed layer has a homogeneous thickness distribution and a smooth outer surface which are both desired properties.
    Type: Application
    Filed: September 11, 2014
    Publication date: July 7, 2016
    Inventors: Matthias DAMMASCH, Marco HARYONO, Sengül KARASAHIN, Hans-Jürgen SCHREIER