Abstract: An integrated circuit package includes a case incorporating an integrated circuit die. The case has several ceramic layers, including layers with apertures for defining a die cavity and two layers without apertures which serve as thermal path layers. The thermal path layers include mutually staggered vias which conduct heat from the die cavity to a heat spreader separated from the die by the thermal path layers. The vias of the two layers are not electrically coupled so that the heat spreader is thermally coupled and electrically uncoupled with respect to the die. The thermal path layers, the thermal vias and other thermal path elements are fabricated from the same set of materials used in the cavity-defining layers, electrical vias and conductive strips.