Patents by Inventor Marco Mendes
Marco Mendes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11820119Abstract: Laser lift off systems and methods overlap irradiation zones to provide multiple pulses of laser irradiation per location at the interface between layers of material to be separated. To overlap irradiation zones, the laser lift off systems and methods provide stepwise relative movement between a pulsed laser beam and a workpiece. The laser irradiation may be provided by a non-homogeneous laser beam with a smooth spatial distribution of energy across the beam profile. The pulses of laser irradiation from the non-homogenous beam may irradiate the overlapping irradiation zones such that each of the locations at the interface is exposed to different portions of the non-homogeneous beam for each of the multiple pulses of the laser irradiation, thereby resulting in self-homogenization. Thus, the number of the multiple pulses of laser irradiation per location is generally sufficient to provide the self-homogenization and to separate the layers of material.Type: GrantFiled: April 12, 2021Date of Patent: November 21, 2023Assignee: IPG PHOTONICS CORPORATIONInventors: Cristian Porneala, Mathew Hannon, Marco Mendes, Jeffrey P. Sercel
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Patent number: 11819949Abstract: Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).Type: GrantFiled: October 19, 2020Date of Patent: November 21, 2023Assignee: IPG PHOTONICS CORPORATIONInventors: Jeffrey P. Sercel, Marco Mendes, Rouzbeh Sarrafi, Joshua Schoenly, Xiangyang Song, Mathew Hannon, Miroslaw Sokol
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Patent number: 11772063Abstract: The present invention relates to a method and a device for producing saccharides and saccharide arrays. Said method is particularly useful for the synthesis of saccharides in parallel and of high-density saccharide arrays, such as microarrays, which are required for high-throughput screenings.Type: GrantFiled: December 17, 2019Date of Patent: October 3, 2023Assignee: Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V.Inventors: Felix Löffler, Marco Mende, Stephan Eickelmann, Peter H. Seeberger, Alexandra Tsouka, Jasmin Heidepriem, Grigori Paris
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Publication number: 20230289361Abstract: The invention relates to a method for generating items of context-dependent information for informing a user about a status of a technical system, wherein the items of context-dependent information of the technical system are provided by various data sources. In order to obtain items of information about a new context of the technical system without real data sources, it is proposed that estimated context-dependent items of information of a new context are generated by correlating the data elements of the various data sources and without knowledge of real values of the new context, but based on known and experience-related values, and provided to the user.Type: ApplicationFiled: March 9, 2023Publication date: September 14, 2023Applicant: SCHNEIDER ELECTRIC INDUSTRIES SASInventor: Marco MENDES
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Patent number: 11565350Abstract: Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).Type: GrantFiled: May 24, 2019Date of Patent: January 31, 2023Assignee: IPG PHOTONICS CORPORATIONInventors: Jeffrey P. Sercel, Marco Mendes, Rouzbeh Sarrafi, Joshua Schoenly, Xiangyang Song, Mathew Hannon, Miroslaw Sokol
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Publication number: 20220062849Abstract: The present invention relates to a method and a device for producing saccharides and saccharide arrays. Said method is particularly useful for the synthesis of saccharides in parallel and of high-density saccharide arrays, such as microarrays, which are required for high-throughput screenings.Type: ApplicationFiled: December 17, 2019Publication date: March 3, 2022Applicant: Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V.Inventors: Felix Löffler, Marco Mende, Stephan Eickelmann, Peter H. Seeberger, Alexandra Tsouka, Jasmin Heidepriem, Grigori Paris
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Patent number: 11239116Abstract: Laser lift off systems and methods may be used to provide monolithic laser lift off with minimal cracking by reducing the size of one or more beam spots in one or more dimensions to reduce plume pressure while maintaining sufficient energy to provide separation. By irradiating irradiation zones with various shapes and in various patterns, the laser lift off systems and methods use laser energy more efficiently, reduce cracking when separating layers, and improve productivity. Some laser lift off systems and methods described herein separate layers of material by irradiating non-contiguous irradiation zones with laser lift off zones (LOZs) that extend beyond the irradiation zones. Other laser lift off systems and methods described herein separate layers of material by shaping the irradiation zones and by controlling the overlap of the irradiation zones in a way that avoids uneven exposure of the workpiece.Type: GrantFiled: May 21, 2019Date of Patent: February 1, 2022Assignee: IPG PHOTONICS CORPORATIONInventors: Jeffrey P. Sercel, Marco Mendes, Jie Fu
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Publication number: 20210300011Abstract: Laser lift off systems and methods overlap irradiation zones to provide multiple pulses of laser irradiation per location at the interface between layers of material to be separated. To overlap irradiation zones, the laser lift off systems and methods provide stepwise relative movement between a pulsed laser beam and a workpiece. The laser irradiation may be provided by a non-homogeneous laser beam with a smooth spatial distribution of energy across the beam profile. The pulses of laser irradiation from the non-homogenous beam may irradiate the overlapping irradiation zones such that each of the locations at the interface is exposed to different portions of the non-homogeneous beam for each of the multiple pulses of the laser irradiation, thereby resulting in self-homogenization. Thus, the number of the multiple pulses of laser irradiation per location is generally sufficient to provide the self-homogenization and to separate the layers of material.Type: ApplicationFiled: April 12, 2021Publication date: September 30, 2021Inventors: Cristian Porneala, Mathew Hannon, Marco Mendes, Jeffrey P. Sercel
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Patent number: 10974494Abstract: Laser lift off systems and methods overlap irradiation zones to provide multiple pulses of laser irradiation per location at the interface between layers of material to be separated. To overlap irradiation zones, the laser lift off systems and methods provide stepwise relative movement between a pulsed laser beam and a workpiece. The laser irradiation may be provided by a non-homogeneous laser beam with a smooth spatial distribution of energy across the beam profile. The pulses of laser irradiation from the non-homogenous beam may irradiate the overlapping irradiation zones such that each of the locations at the interface is exposed to different portions of the non-homogeneous beam for each of the multiple pulses of the laser irradiation, thereby resulting in self-homogenization. Thus, the number of the multiple pulses of laser irradiation per location is generally sufficient to provide the self-homogenization and to separate the layers of material.Type: GrantFiled: June 5, 2017Date of Patent: April 13, 2021Assignee: IPG PHOTONICS CORPORATIONInventors: Cristian Porneala, Mathew Hannon, Marco Mendes, Jeffrey P. Sercel
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Publication number: 20210094127Abstract: Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).Type: ApplicationFiled: October 19, 2020Publication date: April 1, 2021Inventors: Jeffrey P. Sercel, Marco Mendes, Rouzbeh Sarrafi, Joshua Schoenly, Xiangyang Song, Mathew Hannon, Miroslaw Sokol
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Patent number: 10807199Abstract: Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).Type: GrantFiled: September 19, 2017Date of Patent: October 20, 2020Assignee: IPG PHOTONICS CORPORATIONInventors: Jeffrey P. Sercel, Marco Mendes, Rouzbeh Sarrafi, Joshua Schoenly, Xiangyang Song, Mathew Hannon, Miroslaw Sokol
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Publication number: 20190314934Abstract: Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).Type: ApplicationFiled: May 24, 2019Publication date: October 17, 2019Inventors: Jeffrey P. Sercel, Marco Mendes, Rouzbeh Sarrafi, Joshua Schoenly, Xiangyang Song, Mathew Hannon, Miroslaw Sokol
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Publication number: 20190279905Abstract: Laser lift off systems and methods may be used to provide monolithic laser lift off with minimal cracking by reducing the size of one or more beam spots in one or more dimensions to reduce plume pressure while maintaining sufficient energy to provide separation. By irradiating irradiation zones with various shapes and in various patterns, the laser lift off systems and methods use laser energy more efficiently, reduce cracking when separating layers, and improve productivity. Some laser lift off systems and methods described herein separate layers of material by irradiating non-contiguous irradiation zones with laser lift off zones (LOZs) that extend beyond the irradiation zones. Other laser lift off systems and methods described herein separate layers of material by shaping the irradiation zones and by controlling the overlap of the irradiation zones in a way that avoids uneven exposure of the workpiece.Type: ApplicationFiled: May 21, 2019Publication date: September 12, 2019Inventors: Jeffrey P. Sercel, Marco Mendes, Jie Fu
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Patent number: 10343237Abstract: Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).Type: GrantFiled: August 28, 2015Date of Patent: July 9, 2019Assignee: IPG PHOTONICS CORPORATIONInventors: Jeffrey P. Sercel, Marco Mendes, Rouzbeh Sarrafi, Joshua Schoenly, Xiangyang Song, Mathew Hannon, Miroslaw Sokol
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Patent number: 10297503Abstract: Laser lift off systems and methods may be used to provide monolithic laser lift off with minimal cracking by reducing the size of one or more beam spots in one or more dimensions to reduce plume pressure while maintaining sufficient energy to provide separation. By irradiating irradiation zones with various shapes and in various patterns, the laser lift off systems and methods use laser energy more efficiently, reduce cracking when separating layers, and improve productivity. Some laser lift off systems and methods described herein separate layers of material by irradiating non-contiguous irradiation zones with laser lift off zones (LOZs) that extend beyond the irradiation zones. Other laser lift off systems and methods described herein separate layers of material by shaping the irradiation zones and by controlling the overlap of the irradiation zones in a way that avoids uneven exposure of the workpiece.Type: GrantFiled: February 18, 2015Date of Patent: May 21, 2019Assignee: IPG PHOTONICS CORPORATIONInventors: Jeffrey P. Sercel, Marco Mendes, Jie Fu
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Patent number: 10286487Abstract: Laser processing of sapphire is performed using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm (hereinafter “QCW laser”). Laser processing of sapphire using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 10%) and in an inert gas atmosphere such as argon or helium. Laser processing of sapphire using a QCW laser may further include the use of an assist laser having a shorter wavelength and/or pulse duration to modify a property of the sapphire substrate to form absorption centers, which facilitate coupling of the laser light pulses of the QCW laser into the sapphire.Type: GrantFiled: February 28, 2014Date of Patent: May 14, 2019Assignee: IPG PHOTONICS CORPORATIONInventors: Vijay Kancharla, William Shiner, Steven Maynard, Jeffrey P. Sercel, Marco Mendes, Rouzbeh Sarrafi
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Patent number: 9956646Abstract: Multiple-beam laser processing may be performed on a workpiece using at least first and second laser beams with different characteristics (e.g., wavelengths and/or pulse durations). In some applications, an assist laser beam is directed at a target location on or within the workpiece to modify a property of the non-absorptive material. A process laser beam is directed at the target location and is coupled into absorption centers formed in the non-absorptive material to complete processing of the non-absorptive material. Multiple-beam laser processing may be used, for example, to drill holes in a substrate made of alumina or other transparent ceramics. In other applications, multiple-beam laser processing may be used in melting applications such as micro-welding, soldering, and forming laser fired contacts. In these applications, the assist laser beam may be used to modify a property of the material or to change the geometry of the parts.Type: GrantFiled: February 27, 2015Date of Patent: May 1, 2018Assignee: IPG Photonics CorporationInventors: Marco Mendes, Jeffrey P. Sercel, Rouzbeh Sarrafi, Xiangyang Song, Joshua Schoenly, Roy Van Gemert, Cristian Porneala
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Publication number: 20180001425Abstract: Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).Type: ApplicationFiled: September 19, 2017Publication date: January 4, 2018Inventors: Jeffrey P. SERCEL, Marco MENDES, Rouzbeh SARRAFI, Joshua SCHOENLY, Xiangyang SONG, Mathew HANNON, Miroslaw SOKOL
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Publication number: 20170266946Abstract: Laser lift off systems and methods overlap irradiation zones to provide multiple pulses of laser irradiation per location at the interface between layers of material to be separated. To overlap irradiation zones, the laser lift off systems and methods provide stepwise relative movement between a pulsed laser beam and a workpiece. The laser irradiation may be provided by a non-homogeneous laser beam with a smooth spatial distribution of energy across the beam profile. The pulses of laser irradiation from the non-homogenous beam may irradiate the overlapping irradiation zones such that each of the locations at the interface is exposed to different portions of the non-homogeneous beam for each of the multiple pulses of the laser irradiation, thereby resulting in self-homogenization. Thus, the number of the multiple pulses of laser irradiation per location is generally sufficient to provide the self-homogenization and to separate the layers of material.Type: ApplicationFiled: June 5, 2017Publication date: September 21, 2017Inventors: Cristian PORNEALA, Mathew HANNON, Marco MENDES, Jeffrey P. SERCEL
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Patent number: 9764427Abstract: Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).Type: GrantFiled: August 28, 2015Date of Patent: September 19, 2017Assignee: IPG Photonics CorporationInventors: Jeffrey P. Sercel, Marco Mendes, Rouzbeh Sarrafi, Joshua Schoenly, Xiangyang Song, Mathew Hannon, Miroslaw Sokol