Abstract: A portable sanitizing arrangement is disclosed comprising essentially a protective case for a mobile productivity device such as a smartphone together with an ultraviolet light source for convenient disinfecting of high-touch objects and surfaces. The arrangement further comprises user controls and interfaces to enable the ultraviolet light source to safely emit light at wavelengths known to kill and destroy bacterial and viral species among other potentially harmful microorganisms. The sanitizing arrangement may irradiate the mobile productivity device itself as well as commonly encountered objects and surfaces in work, travel, entertainment and home environments with substantially greater ease and convenience and at potentially lower cost than with known sanitizing devices and methods.

Abstract: Integration of semiconductor tool maintenance operations on mobile devices to allow technicians to more accurately perform semiconductor tool maintenance and to allow more accurate analysis of data to improve maintenance procedures to be more repeatable, consistent, and efficient. Remote control of maintenance operations for the semiconductor tool via a portable electronic device decreases the time required to service semiconductor tools and thus increase throughput.

Abstract: Integration of semiconductor tool maintenance operations on mobile devices enables technicians to more accurately perform semiconductor tool maintenance, and allows for more accurate collection and analysis of data so that maintenance procedures and resulting tool operations can be more repeatable, consistent and efficient.

Abstract: Integration of semiconductor tool maintenance operations on mobile devices to allow technicians to more accurately perform semiconductor tool maintenance and to allow more accurate analysis of data to improve maintenance procedures to be more repeatable, consistent, and efficient. Remote control of maintenance operations for the semiconductor tool via a portable electronic device decreases the time required to service semiconductor tools and thus increase throughput.

Abstract: A wireless memory card device includes a casing having a width, a length, and a thickness for supporting an integrated power supply. The device has one or more solar cell modules spatially disposed on a first portion of the casing. The device further includes a power supply control circuitry coupled to the one or more solar cell modules for providing regulated voltages to the device. In addition, the device includes a flash memory module provided in a second portion of the casing and a wireless communication module provided on a third portion of the casing. The device further includes one or more antennas coupled to the wireless communication module for transmitting and receiving data packets to and from a host system. The device additionally includes a power-on switch and an indicator signal for indicating the wireless data transfer between the device and the host system.

Abstract: A wireless memory card device includes a casing having a width, a length, and a thickness for supporting an integrated power supply. The device has one or more solar cell modules spatially disposed on a first portion of the casing. The device further includes a power supply control circuitry coupled to the one or more solar cell modules for providing regulated voltages to the device. In addition, the device includes a flash memory module provided in a second portion of the casing and a wireless communication module provided on a third portion of the casing. The device further includes one or more antennas coupled to the wireless communication module for transmitting and receiving data packets to and from a host system. The device additionally includes a power-on switch and an indicator signal for indicating the wireless data transfer between the device and the host system.

Abstract: A method is disclosed wherein monolythic integrated circuit undergo a so-called aluminum annealing process step and so-called passivation step carried out within a deposition reactor of the PECVD type at a temperature of 420.degree. to 450.degree. C. and a pressure of 1 to 1.5 Torr. Applications of this method results in an increased electrical yield of the circuits produced and a reduction of their manufacturing costs.