Abstract: A method of calibrating an impedance control of a robot manipulator, the method including: deflecting a reference point of the robot manipulator from a zero position to a deflected position, wherein the robot manipulator applies a counterforce dependent on a spring constant of the impedance control and on a first determined deflection, wherein the first determined deflection is determined based on joint angles detected by joint angle sensors of the robot manipulator; detecting a second determined deflection by an external position measuring unit; and adapting the spring constant of the impedance control in such a way that the counterforce applied by the robot manipulator corresponds to a predetermined counterforce of the robot manipulator based on the second determined deflection.

Abstract: A robot system including: a robot manipulator that includes links interconnected by joints with degrees of freedom that are at least partially redundant to one another; an operating unit configured to detect an input from a user with respect to at least one selected direction of a force; and a control unit configured to receive the input from the operating unit, determine components of a transpose of a Jacobian matrix associated with a respective selected direction for a predetermined position and/or orientation of a distal end of the robot manipulator in a null space such that a first metric based on the components satisfies one of following criteria: unequal to zero, greater than a specified limit, or a maximum, and control the robot manipulator to move a subset of the links in the null space so as to assume a pose according to the components as determined.

Abstract: The present invention relates to a method, a system and an information technology product for collecting funds for a non-profit organization by means of a fund-collection program managed by an intermediary, the funds being given by one or more donors. The method comprises the steps of storing one or more projects having social aims in a first server which is in signal communication with a computer network, providing a communication interface which is in signal communication with the first server by means of the computer network, the interface being configured to interact by means of one or more electronic devices of the at least one donor, selecting, by means of the communication interface, at least one of the projects having social aims proposed by a first non-profit organization, and receiving one or more sums of money given by the at least one donor for the project.

Abstract: A wafer polishing apparatus for polishing a semiconductor wafer. The polisher comprises a base (23), a turntable (27), a polishing pad (29) and a drive mechanism (45) for driven rotation of a polishing head (63). The polishing head is adapted to hold at least one wafer (35) for engaging a front surface of the wafer with a work surface of the polishing pad. A spherical bearing assembly (75) mounts the polishing head (63) on the drive mechanism for pivoting of the polishing head about a gimbal point (p) lying no higher than the work surface when the polishing head holds the wafer in engagement with the polishing pad. This pivoting allowing the plane of the front surface of the wafer to continuously align itself to equalize polishing pressure over the front surface of the wafer, while rotation of the polishing head is driven by the driving mechanism.

Abstract: Wafer polishing apparatus includes a turntable having a polishing surface thereon, and a frame mounting the turntable for rotation relative to the frame about an axis. A pressure plate mounted by a spindle rotates about an axis spaced from the axis of rotation of the turntable, but is held from rotation about the axis of rotation of the turntable. The pressure plate is constructed for simultaneously holding multiple wafers with a polish face of the wafers facing the polishing surface of the turntable. The wafers are pressed against the polishing surface of the turntable by a cylinder which applies a force to the pressure plate. A floating head assembly operatively connecting the wafers to the pressure plate reorients the wafer relative to the pressure plate in response to pressure differentials over the polish face of the wafer engaging the polishing surface to substantially equalize the pressure distribution over the polish face of the wafer.