Patents by Inventor Marco Schmidt

Marco Schmidt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040234738
    Abstract: The invention relates to the use of microcapsules with latent heat storage materials as capsule cores on gypsum plasterboards, gypsum plasterboards containing the same and a method for production thereof.
    Type: Application
    Filed: February 10, 2004
    Publication date: November 25, 2004
    Inventors: Ekkehard Jahns, Hans-Jurgen Denu, Joachim Pakusch, Horst Seibert, Marco Schmidt
  • Patent number: 6809148
    Abstract: Polymer dispersions comprise at least one copolymer which contains, as polymerized monomers, a) from 25 to 70% by weight of at least one conjugated aliphatic diene, b) from 25 to 70% by weight of at least one vinylaromatic monomer, c) from 2.5 to 15% by weight of at least one monoester of a C2-C10-alkanediol with acrylic acid or methacrylic acid or c′) from 0.1 to 10% by weight of at least one alkylpolyethylene glycol (meth)acrylate of the formula (I) where R1 is hydrogen or methyl, R2 is C1-C4-alkyl and n is an integer from 1 to 100, or c″) from 2 to 15% by weight of a mixture of the monoester c) and the alkylpolyethylene glycol (meth)acrylate c′), d) from 0 to 1.0% by weight of ethylenically unsaturated monomers which have at least one acid group, or salts thereof, e) from 0 to 5.0% by weight of ethylenically unsaturated nitriles and f) from 0 to 1.0% by weight of amides of &agr;,&bgr;-ethylenically unsaturated mono- and dicarboxylic acids.
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: October 26, 2004
    Assignee: BASF Aktiengesellschaft
    Inventors: Markus Koppers, Joachim Pakusch, Hermann Anders, Marco Schmidt, Hans-Jürgen Denu
  • Publication number: 20040156994
    Abstract: Aqueous dispersions of composite particles composed of addition polymer and finely divided inorganic solid and obtainable by free-radical emulsion polymerization on a mixture of ethylenically unsaturated monomers including at least one ethylenically unsaturated alkoxysilane monomer in an aqueous medium in the presence of a dispersely distributed, finely divided inorganic solid and at least one dispersant are used to prime mineral substrates.
    Type: Application
    Filed: December 19, 2003
    Publication date: August 12, 2004
    Applicant: BASF Aktiengesellschaft
    Inventors: Harm Wiese, Alexander Centner, Stefan Kirsch, Marco Schmidt, Ines Pietsch, Matthias Laubender
  • Patent number: 6710118
    Abstract: An aqueous polymer dispersion whose polymer, present in disperse distribution, is composed in free-radically polymerized form of from 20 to 65% by weight of at least one vinylaromatic monomer (monomers A), from 30 to 75% by weight of at least one monomer having two conjugated, ethylenically unsaturated double bonds (monomers B), and from 0.5 to 10% by weight of at least one other monomer, C, selected from the group consisting of &agr;,&bgr;-monoethyienically unsaturated mono- and dicarboxylic acids and amide or ester derivatives thereof and whose alkali metal ion content GA, based on the mass of the dispersed polymer, is ≧0.5% by weight, the pH of the aqueous dispersion medium being adjusted to a value below 6.
    Type: Grant
    Filed: November 6, 2002
    Date of Patent: March 23, 2004
    Assignee: BASF Aktiengesellschaft
    Inventors: Markus Koppers, Marco Schmidt, Thomas Anselmann, Jürgen Schmidt-Thümmes, Mike Zott, Eckehardt Wistuba
  • Patent number: 6700191
    Abstract: An electronic power circuit includes several power modules (1) and is especially for controlling an electrical machine. Each power module (1) includes a plate-shaped integrated electronic circuit arrangement (2) having several electrical terminals. A perpendicular bent-over electrically conducting side leg (3) is arranged on each of two opposite-lying sides of the plate-shaped circuit arrangement (2). The side leg (3) forms an electrical contact and, in this way, the power module (1) has a U-shaped cross section. Each side leg (3) is provided with connecting elements via which two or several power modules (1) can be electrically and mechanically fixedly connected to each other while forming a mutual spacing between the plate-shaped circuit arrangement (2) via the side legs (3) for forming the electronic power circuit.
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: March 2, 2004
    Assignee: Continental ISAD Electronic Systems GmbH & Co. OHG
    Inventors: Ralf Schmid, Marco Schmidt, Johann Sontheim, Helmut Perkounigg
  • Publication number: 20030211796
    Abstract: Use of intumescent coating materials for the flame-inhibiting finishing of articles containing microencapsulated organic latent-heat storage materials.
    Type: Application
    Filed: April 22, 2003
    Publication date: November 13, 2003
    Applicant: BASF Akitengesellshaft
    Inventors: Ekkehard Jahns, Marco Schmidt, Joachim Pakusch, Horst Seibert
  • Publication number: 20030168252
    Abstract: The invention is a process to facilitate contacting of one or several power electronics components (10) with strip conductors (14, 15) on a substrate (12, 18) with the aid of a contact device (1) with several flat contact elements (6, 8) that are connected to each other by means of bridges (4, 5), including the following steps: (a) the contact device (1) is set on the upper side of the component (10); (b) the underside of a contact element (6, 8) is electrically connected both with a contact surface (S, G) on the upper side of a component (10) and with a strip conductor (14, 15); (c) at least one of the bridges (4, 5) between the individual contact elements (6, 8) is severed by means of thermal gouging. The invention also includes an assembly (16, 16′) produced with the process as well as a contact device (1) with several flat contact elements (6, 7) to facilitate contacting of power electronics components (10).
    Type: Application
    Filed: November 27, 2002
    Publication date: September 11, 2003
    Inventors: Ralf Schmid, Marco Schmidt
  • Publication number: 20030139522
    Abstract: An aqueous polymer dispersion whose polymer, present in disperse distribution, is composed in free-radically polymerized form of
    Type: Application
    Filed: November 6, 2002
    Publication date: July 24, 2003
    Applicant: BASF Akiengesellschaft
    Inventors: Markus Koppers, Marco Schmidt, Thomas Anselmann, Juergen Schmidt-Thuemmes, Mike Zott, Eckehardt Wistuba
  • Publication number: 20020137399
    Abstract: An electronic power circuit includes several power modules (1) and is especially for controlling an electrical machine. Each power module (1) includes a plate-shaped integrated electronic circuit arrangement (2) having several electrical terminals. A perpendicular bent-over electrically conducting side leg (3) is arranged on each of two opposite-lying sides of the plate-shaped circuit arrangement (2). The side leg (3) forms an electrical contact and, in this way, the power module (1) has a U-shaped cross section. Each side leg (3) is provided with connecting elements via which two or several power modules (1) can be electrically and mechanically fixedly connected to each other while forming a mutual spacing between the plate-shaped circuit arrangement (2) via the side legs (3) for forming the electronic power circuit.
    Type: Application
    Filed: March 22, 2002
    Publication date: September 26, 2002
    Inventors: Ralf Schmid, Marco Schmidt, Johann Sontheim, Helmut Perkounigg
  • Patent number: 5915163
    Abstract: Method of manufacturing a laser which is provided with a metal layer and a solder layer as early as in the wafer stage, and which is particularly suitable for so-called epi-down final mounting. An individual laser is obtained in that first a block comprising a row of lasers is formed from the wafer by cleaving, and subsequently the individual lasers are separated from the block. Strip-shaped openings are formed in the metal layer at the areas of end faces to be formed before the block is formed, and subsequently a score is provided in the surface of the semiconductor body in each opening in the longitudinal direction thereof, whereupon the solder layer is provided over the metal layer and over at least part of the openings therein, and the block is subsequently formed through cleaving at the areas of and in the direction of the scores.
    Type: Grant
    Filed: December 6, 1996
    Date of Patent: June 22, 1999
    Assignee: Uniphase Opto Holdings, Incorporated
    Inventors: Arjan Noordermeer, Marco Schmidt