Patents by Inventor Marcus Hatch

Marcus Hatch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9121701
    Abstract: A fiber optically coupled laser rangefinder (LRF) for use in a gimbal system to input/extract a laser beam into/from a camera is disclosed. In one embodiment, the fiber optically coupled LRF includes a gimbal assembly. Further, the gimbal assembly includes a first fiber optic cable for receiving the laser beam from a remote transmitter assembly, a fiber optically coupled laser interface module to receive the laser beam and opposing mirrors to direct the laser beam to a target. In addition, the gimbal assembly includes a second fiber optic cable for transmitting a return laser beam to a remote receiver assembly. The opposing mirrors are further configured to direct the return laser beam from the target to the fiber optically coupled laser interface module. The fiber optically coupled laser interface module is further configured to transmit it to the receiver assembly via the second fiber optic cable.
    Type: Grant
    Filed: August 21, 2012
    Date of Patent: September 1, 2015
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: William E. Shaw, Bruce Whaley, Marcus Hatch, Raymond J. Silva, Michael E. DeFlumere
  • Patent number: 8712201
    Abstract: An optic assembly is provided, that assembly comprising: a bullet collection lens; a plurality of fiber optic fiber bundles; and those fiber optic bundles being parallel to a central channel.
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: April 29, 2014
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Michael J. Choiniere, Chris M. Bower, James R. Lynch, III, Carl Alan Way, Marcus Hatch
  • Publication number: 20130222784
    Abstract: A fiber optically coupled laser rangefinder (LRF) for use in a gimbal system to input/extract a laser beam into/from a camera is disclosed. in one embodiment, the fiber optically coupled LRF includes a gimbal assembly. Further, the gimbal assembly includes a first fiber optic cable for receiving the laser beam from a remote transmitter assembly, a fiber optically coupled laser interface module to receive the laser beam and opposing mirrors to direct the laser beam to a target. In addition, the gimbal assembly includes a second fiber optic cable for transmitting a return laser beam to a remote receiver assembly. The opposing mirrors are further configured to direct the return laser bean from the target to the fiber optically coupled laser interface module. The fiber optically coupled laser interface module is further configured to transmit it to the receiver assembly via the second fiber optic cable.
    Type: Application
    Filed: August 21, 2012
    Publication date: August 29, 2013
    Applicant: BAE Systems information and Electronic Systems Integration Inc.
    Inventors: William E. Shaw, Bruce Whaley, Marcus Hatch, Raymond J. Silva, Michael E. DeFlumere
  • Publication number: 20120082423
    Abstract: An optic assembly is provided, that assembly comprising: a bullet collection lens; a plurality of fiber optic fiber bundles; and those fiber optic bundles being parallel to a central channel.
    Type: Application
    Filed: April 8, 2011
    Publication date: April 5, 2012
    Inventors: Michael J. Choiniere, Chris M. Bower, James R. Lynch, III, Carl Alan Way, Marcus Hatch
  • Patent number: 5732706
    Abstract: An array of ultrasonic transducers, where each of the ultrasonic transducers has a matching layer end and a driving layer/individually isolated end. A bump bond connects each one of the ultrasonic transducers to a substrate. A high voltage electrical conductor is connected to at least one driving layer/individually isolated end to provide a drive signal to at least one of the ultrasonic transducers. A conductive/matching layer is disposed to electrically connect each matching layer end. An outer matching layer is connected to the conductive/matching layer. The bump bond is an indium or solder bump bond having a contact area for contact with an ultrasonic transducer less than 20 percent of the driving layer/individually isolated end for the contacted ultrasonic transducer so as to provide mechanical stability while reducing cross talk among the plurality of ultrasonic transducers.
    Type: Grant
    Filed: March 22, 1996
    Date of Patent: March 31, 1998
    Assignee: Lockheed Martin IR Imaging Systems, Inc.
    Inventors: Timothy E. White, Neal R. Butler, Marcus Hatch, Kenneth R. Erikson, Curtis A. Vock, Wayne C. Haase, Michael A. Martinelli