Patents by Inventor Marcus Ruhnau
Marcus Ruhnau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8314441Abstract: An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or -receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.Type: GrantFiled: April 11, 2011Date of Patent: November 20, 2012Assignee: OSRAM Opto Semiconductors GmbHInventors: Marcus Ruhnau, Bert Braune, Patrick Kromotis, Georg Bogner
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Publication number: 20110180822Abstract: An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or—receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.Type: ApplicationFiled: April 11, 2011Publication date: July 28, 2011Inventors: Marcus RUHNAU, Bert BRAUNE, Patrick KROMOTIS, Georg BOGNER
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Patent number: 7948046Abstract: An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or-receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.Type: GrantFiled: September 10, 2010Date of Patent: May 24, 2011Assignee: OSRAM Opto Semiconductor GmbHInventors: Marcus Ruhnau, Bert Braune, Patrick Kromotis, Georg Bogner
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Publication number: 20100327307Abstract: An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or-receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.Type: ApplicationFiled: September 10, 2010Publication date: December 30, 2010Inventors: Marcus Ruhnau, Bert Braune, Patrick Kromotis, Georg Bogner
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Patent number: 7795633Abstract: An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or-receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.Type: GrantFiled: September 30, 2008Date of Patent: September 14, 2010Assignee: Osram Opto Semiconductors GmbHInventors: Marcus Ruhnau, Bert Braune, Patrick Kromotis, Georg Bogner
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Patent number: 7514279Abstract: An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.Type: GrantFiled: December 2, 2004Date of Patent: April 7, 2009Assignee: Osram Opto Semiconductors GmbHInventors: Marcus Ruhnau, Bert Braune, Patrick Kromotis, Georg Bogner
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Publication number: 20090026482Abstract: An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or-receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.Type: ApplicationFiled: September 30, 2008Publication date: January 29, 2009Inventors: Marcus RUHNAU, Bert Braune, Patrick Kromotis, Georg Bogner
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Patent number: 7429758Abstract: An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.Type: GrantFiled: May 31, 2005Date of Patent: September 30, 2008Assignee: Osram Opto Semiconductor GmbHInventors: Marcus Ruhnau, Bert Braune, Patrick Kromotis, Georg Bogner
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Patent number: 7045956Abstract: The invention relates to a wavelength-converting reaction resin compound into which a wavelength-converting luminescent material and a thixotroping agent are mixed, wherein the luminescent material contains inorganic luminescent particles. The thixotroping agent is present, at least in part, in the form of nanoparticles. Methods of producing the reaction resin compound and light-emitting diode elements having such reaction resin compounds are indicated.Type: GrantFiled: May 5, 2003Date of Patent: May 16, 2006Assignee: Osram Opto Semiconductors GmbHInventors: Bert Braune, Marcus Ruhnau
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Publication number: 20050218531Abstract: An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.Type: ApplicationFiled: May 31, 2005Publication date: October 6, 2005Inventors: Marcus Ruhnau, Bert Braune, Patrick Kromotis, George Bogner
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Patent number: 6900511Abstract: An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.Type: GrantFiled: June 27, 2003Date of Patent: May 31, 2005Assignee: Osram Opto Semiconductors GmbHInventors: Marcus Ruhnau, Bert Braune, Patrick Kromotis, Georg Bogner
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Publication number: 20050093005Abstract: An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.Type: ApplicationFiled: December 2, 2004Publication date: May 5, 2005Inventors: Marcus Ruhnau, Bert Braune, Patrick Kromotis, Georg Bogner
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Publication number: 20040094757Abstract: The invention relates to a wavelength-converting reaction resin compound (5) into which a wavelength-converting luminescent material (6) and a thixotroping agent are mixed, wherein the luminescent material contains inorganic luminescent particles. The thixotroping agent is present, at least in part, in the form of nanoparticles. Methods of producing the reaction resin compound and light-emitting diode elements having such reaction resin compounds are indicated.Type: ApplicationFiled: May 5, 2003Publication date: May 20, 2004Inventors: Bert Braune, Marcus Ruhnau
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Publication number: 20040089898Abstract: An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.Type: ApplicationFiled: June 27, 2003Publication date: May 13, 2004Applicant: Osram Opto Semiconductors GmbHInventors: Marcus Ruhnau, Bert Braune, Patrick Kromotis, Georg Bogner