Abstract: An apparatus for recutting the surface of a wheel is described. The apparatus comprises a rotatable mount, for holding and rotating the wheel about its axis, a surface profiler, configured to detect and output a surface elevation profile of a concentric ring at a current radial position on the surface of the wheel, a linear drive mechanism, configured to reposition the surface profiler radially with respect to the wheel, a radial profile generator, configured to calculate a cutting profile for the wheel based on the surface elevation profile for each concentric ring, a cutting tool, and cutting control circuitry, configured to control the position of the cutting tool with respect to the wheel to recut the surface of the wheel in accordance with the generated cutting profile.