Abstract: A transimpedance amplifier and photodiode that has a bias voltage node established at a bias voltage and a ground node/plane that connects, over a short distance as compared to the prior art, to a photodiode and a transimpedance amplifier. The photodiode is in a substrate and configured to receive and convert an optical signal to an electrical current. The photodiode has an anode terminal and a cathode terminal which is connected to the bias voltage node. One or more capacitors in or on the substrate and connected between the bias node and the ground node. The transimpedance amplifier has an input connected to the anode terminal of the photodiode and an output that presents a voltage representing the optical signal to an output path. The transimpedance amplifier and the photodiode are both electrically connected in a flip chip configuration and the ground plane creates a coplanar waveguide.

Abstract: A transimpedance amplifier and photodiode that has a bias voltage node established at a bias voltage and a ground node/plane that connects, over a short distance as compared to the prior art, to a photodiode and a transimpedance amplifier. The photodiode is in a substrate and configured to receive and convert an optical signal to an electrical current. The photodiode has an anode terminal and a cathode terminal which is connected to the bias voltage node. One or more capacitors in or on the substrate and connected between the bias node and the ground node. The transimpedance amplifier has an input connected to the anode terminal of the photodiode and an output that presents a voltage representing the optical signal to an output path. The transimpedance amplifier and the photodiode are both electrically connected in a flip chip configuration and the ground plane creates a coplanar waveguide.

Abstract: A transimpedance amplifier and photodiode that has a bias voltage node established at a bias voltage and a ground node/plane that connects, over a short distance as compared to the prior art, to a photodiode and a transimpedance amplifier. The photodiode is in a substrate and configured to receive and convert an optical signal to an electrical current. The photodiode has an anode terminal and a cathode terminal which is connected to the bias voltage node. One or more capacitors in or on the substrate and connected between the bias node and the ground node. The transimpedance amplifier has an input connected to the anode terminal of the photodiode and an output that presents a voltage representing the optical signal to an output path. The transimpedance amplifier and the photodiode are both electrically connected in a flip chip configuration and the ground plane creates a coplanar waveguide.

Abstract: An optic module for use with a host is disclosed that includes a port configured to accept an optical connector connected to fiber optic cables which carry optic signals. A receiver module is configured to receive an incoming optic signal and convert the received optic signal to a received electrical signal while a transimpedance amplifier amplifies the received electrical signal. An electrical interface is configured to electrically interface the optic module with the host thereby providing the amplified received electrical signal to a digital signal processor in the host. On the transmit side, an optic device driver receives an outgoing electrical signal from the host, after processing by a digital signal processor in the host, for amplification while a transmit module is configured to convert the outgoing electrical signal to an outgoing optic signal and transmit the outgoing optic signal on an optic fiber.

Abstract: A transimpedance amplifier and photodiode that has a bias voltage node established at a bias voltage and a ground node/plane that connects, over a short distance as compared to the prior art, to a photodiode and a transimpedance amplifier. The photodiode is in a substrate and configured to receive and convert an optical signal to an electrical current. The photodiode has an anode terminal and a cathode terminal which is connected to the bias voltage node. One or more capacitors in or on the substrate and connected between the bias node and the ground node. The transimpedance amplifier has an input connected to the anode terminal of the photodiode and an output that presents a voltage representing the optical signal to an output path. The transimpedance amplifier and the photodiode are both electrically connected in a flip chip configuration and the ground plane creates a coplanar waveguide.

Abstract: A method for classifying the Quality of Service of the incoming data traffic before the traffic is placed into the priority queues of the Active Queue Management Block of the device is disclosed. By employing a range of mapping schemes during the classification stage of the ingress traffic processing, the invention permits the traffic from a number of users to be coalesced into the appropriate Quality of Service level in the device.

Abstract: A device and a method for aggregating and managing large quantities of data are disclosed. The received data are prioritized into high and low priority queues. The device receive memory is partitioned into 1 Kilo byte (1 KB) blocks which are further divided into free list and allocation list. The low priority queues occupy between 1 and 48 blocks and the high priority queues occupy between 1 and 32 blocks. The incoming data are further subjected to Weighted Random Early Detection (WRED) process that controls congestion before it occurs by dropping some of the queues. The stored data are read using Modified Deficit Round Robin (MDRR) approach The transmit memory operates with 240 1 KB blocks and the data is transmitted out via an SPI 4.2 or similar device.