Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a package substrate, where the package substrate comprises a plurality of buildup layers, and where each buildup layer has fiber reinforcement. In an embodiment, the electronic package further comprises a reinforcement layer, where the reinforcement layer comprises a buildup layer and fiber reinforcement, and where an orientation of the fibers in the reinforcement layer is different than an orientation of the fibers in the package substrate.

Abstract: Embodiments disclosed herein include modular electronics packages and methods of forming such packages. In an embodiment, the electronics package comprises a first connector module having a notch on a first end and a plurality of surface mount technology (SMT) pads on a second end. In an embodiment, the electronics package further comprises a second connector module having a keyed connector on a first end and a plurality of SMT pads on a second end. In an embodiment, the electronics package further comprises a system in package (SIP) module between the first connector module and the second connector module, the component module electrically and mechanically coupled to the SMT pads of the first connector and the SMT pads of the second connector.

Abstract: An integrated circuit assembly may be formed comprising a stepped electronic substrate having a first surface and an opposing second surface, wherein the first surface comprises a first surface portion or lower step and a second surface portion or upper step. At least one integrated circuit device may be electrically attached to the first surface portion of the first surface of the stepped electronic substrate and an anisotropic conductive layer on the second surface portion of the first surface of stepped electronic substrate. The anisotropic conductive layer may be used to electrically couple the integrated circuit assembly with an additional integrated circuit assembly.

Abstract: Embodiments disclosed herein include modular electronics packages and methods of forming such packages. In an embodiment, the electronics package comprises a first connector module having a notch on a first end and a plurality of surface mount technology (SMT) pads on a second end. In an embodiment, the electronics package further comprises a second connector module having a keyed connector on a first end and a plurality of SMT pads on a second end. In an embodiment, the electronics package further comprises a system in package (SIP) module between the first connector and the second connector, the component module electrically and mechanically coupled to the SMT pads of the first connector and the SMT pads of the second connector.

Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a package substrate, where the package substrate comprises a plurality of buildup layers, and where each buildup layer has fiber reinforcement. In an embodiment, the electronic package further comprises a reinforcement layer, where the reinforcement layer comprises a buildup layer and fiber reinforcement, and where an orientation of the fibers in the reinforcement layer is different than an orientation of the fibers in the package substrate.