Patents by Inventor Maria C. Estacio

Maria C. Estacio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor die package including carrier with mask and semiconductor die
    Patent number: 7157799
    Abstract: A carrier for use in a semiconductor die package is disclosed. In one embodiment, the carrier includes a die attach region and an edge region. A solder mask is on the edge region.
    Type: Grant
    Filed: June 4, 2003
    Date of Patent: January 2, 2007
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Jonathan A. Noquil, Maria C. Estacio