Abstract: A wafer processing system includes a plurality of evacuable housings connected in series to form a processing line, with a plurality isolation valves to separately isolate the housings. A track extends through the connected housings. At least one wafer carrier is moveable on the track, through the housings and along the processing line. The wafer carrier holds wafers in vertical orientation and also includes a plurality of magnets aligned along its bottom. Outside the housings, a plurality of magnetic drive units are aligned parallel with the track, with one drive unit per housing. Each drive unit includes a motor driven conveyor with a plurality of magnets mounted thereon which imposes magnetic fields inside the housing to magnetically couple with the magnets mounted on the carrier. When the motor driven conveyor moves the imposed magnetic fields, the magnetic coupling causes the wafer carrier to move.

Abstract: Wafers from plural non-vacuum multiple wafer carriers are loaded and unloaded in an atmospheric front end of a wafer processing machine and transferred to and from the high vacuum chamber of a transfer module of a wafer manufacturing cluster tool through a plurality of single wafer loadlocks. Preferably, with the wafers oriented horizontally throughout, wafers are moved inbound to the high vacuum atmosphere through one loadlock and moved outbound through another loadlock, the outbound loadlock also actively cooling the wafer. In both the atmospheric and vacuum environments, transfer arms load and unload the loadlocks as often as possible when the other loadlock or loadlocks are sealed, and transfer wafers within the environments when all loadlocks are sealed. Preferably, the wafers are actively cooled in the outbound loadlock. Preferably also, wafers are passed through a wafer aligner after being removed from a carrier and before placed in a loadlock.

Abstract: A device for rotating a substrate in a complex motion within a chamber which during a sputtering process. The device includes a first support element positioned within the chamber. The first support element includes a first rotating structure which is affixed between a platform for supporting the substrate and a first magnet positioned adjacent to the inner wall surface. Further, the first rotating structure is adapted to rotate about a first axis. The device further includes a second support element positioned outside of the chamber. The second support element includes a second rotating structure affixed between a planet gear adapted for engagement with a sun gear outside of the chamber and a second magnet positioned adjacent the outer wall surface and spaced apart from the first magnet. This causes the formation of a magnetic bond between the first and second magnets.