Patents by Inventor Marianne Lösch

Marianne Lösch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6218727
    Abstract: A wafer frame for fixing and handling 200 mm wafers is produced with a significantly reduced weight as compared to a metal wafer frame, while maintaining mechanical and thermal material properties. This is accomplished by producing the wafer frame from a plastic with a glass fiber content of from 1 to 40% by weight.
    Type: Grant
    Filed: February 8, 1999
    Date of Patent: April 17, 2001
    Assignee: Infineon Technologie AG
    Inventors: Reinhold Merkl, Detlef Houdeau, Harald Lösch, Marianne Lösch