Abstract: An active part of a sensor is formed, for example, by micro-machined silicon wafers bearing electronic elements, electrical conductors, connection pads, and pins. The pads are electrically connected to the pin ends by conductive elements. Then the wafer and the pin ends are plunged into an electrolytic bath to make an electrolytic deposit of conductive metal on the pin ends, the pads, and the conductive elements that connect them. Finally, this metal is oxidized or nitrized to form an insulating coat on the pin ends, the pads, and the conductive elements that connect them. Such a sensor may find particular application as a sensor designed to work in harsh environments.

Abstract: A sensor of physical quantities, such as a pressure sensor or an acceleration sensor, and more specifically to the mounting of the active part of the sensor on a base bearing connection pins. An active part of the sensor includes, for example, micro-machined silicon wafers bearing electronic elements, electrical conductors, and connection pads. A base is also prepared, provided with pins whose upper ends are spatially arranged, with each pin facing a respective connection pad. The face bearing the connection pads is applied to the upper part of the pins, and the unit is dipped into an electrolytic bath to deposit metal that rigidly solders the pins to the connection pads. Preferably, the conductive parts, pins, and connection pads of the unit are then covered with an insulator to prevent electrical leakage between pins subjected to different potentials.

Abstract: The invention relates to sensors of physical quantities such as pressure sensors or acceleration sensors, and more specifically to the mounting of the active part of the sensor on a base (30) bearing connection pins (32).