Patents by Inventor Marie-Francoise Bonnal

Marie-Francoise Bonnal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit having a laser connection of a conductor to a doped region of the integrated circuit
    Patent number: 5528072
    Abstract: The conductor 15 to be connected to the doped region 12 of the substrate 11 has an edge 15a at which the laser beam 20 is aimed, regulated such as to definitively create a zone of low electrical resistance 19 in the dielectric layer 13 that separates the conductor from the doped region. The invention is particularly applicable to programming by laser of read only memories and defective integrated circuits with a view to correcting them.
    Type: Grant
    Filed: August 10, 1994
    Date of Patent: June 18, 1996
    Assignee: Bull, S.A.
    Inventors: Alain Boudou, Marie-Francoise Bonnal, Marine Rouillon-Martin
  • Method of laser connection of a conductor to a doped region of the substrate of an integrated circuit
    Patent number: 5231050
    Abstract: The conductor 15 to be connected to the doped region 12 of the substrate 11 has an edge 15a at which the laser beam 20 is aimed, regulated such as to definitively create a zone of low electrical resistance 19 in the dielectric layer 13 that separates the conductor from the doped region. The invention is particularly applicable to programming by laser of read only memories and defective integrated circuits with a view to correcting them.
    Type: Grant
    Filed: April 10, 1990
    Date of Patent: July 27, 1993
    Assignee: Bull, S.A.
    Inventors: Alain Boudou, Marie-Francoise Bonnal, Marine Rouillon-Martin
  • Method for programmable laser connection of two superimposed conductors of the interconnect system of an integrated circuit
    Patent number: 4916809
    Abstract: A method for creating a programmable connection by a laser beam in superimposed conductors of an interconnect system of an integrated circuit is provided wherein each of the conductors is formed of a metal strip provided with an upper and a lower film of a material having a melting point substantially higher than a melting point of said metal strip. The conductors are separated by a dielectric layer and the upper conductor is covered by an insulating passivation layer. The connection is effected through an opening in the insulating layer, the upper conductor, the dielectric layer, and at least a portion of said lower conductor. The method for creating the connection consists of applying at least a first laser beam pulse to make an initial opening in at least said insulating layer; and selectively controlling one or more of the parameters of the laser beam, such as power, diameter, number of pulses and duration of pulses.
    Type: Grant
    Filed: August 17, 1988
    Date of Patent: April 17, 1990
    Assignee: Bull S.A.
    Inventors: Alain Boudou, Marie-Francoise Bonnal