Patents by Inventor Mariko OISHI

Mariko OISHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 11476240
    Abstract: According to one embodiment, a semiconductor device includes a board, a first member, a first adhesive layer, a first electronic component, a second electronic component, and a resin. The board includes a first surface. The first member includes a second surface, and a third surface made of a material including a first organic material. The first adhesive layer adheres to the first surface and the second surface. The first electronic component is attached to the first surface, and embedded in the first adhesive layer. The resin in which the first member, the first adhesive layer, and the second electronic component embedded adheres to the first surface and the third surface.
    Type: Grant
    Filed: September 4, 2018
    Date of Patent: October 18, 2022
    Assignee: Kioxia Corporation
    Inventor: Mariko Oishi
  • SEMICONDUCTOR DEVICE
    Publication number: 20190267364
    Abstract: According to one embodiment, a semiconductor device includes a board, a first member, a first adhesive layer, a first electronic component, a second electronic component, and a resin. The board includes a first surface. The first member includes a second surface, and a third surface made of a material including a first organic material. The first adhesive layer adheres to the first surface and the second surface. The first electronic component is attached to the first surface, and embedded in the first adhesive layer. The resin in which the first member, the first adhesive layer, and the second electronic component embedded adheres to the first surface and the third surface.
    Type: Application
    Filed: September 4, 2018
    Publication date: August 29, 2019
    Applicant: Toshiba Memory Corporation
    Inventor: Mariko OISHI