Patents by Inventor Marina M. Talavera

Marina M. Talavera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7200984
    Abstract: The present invention is directed to a device and method for building a consumable refill that includes the steps of fabricating a plurality of arrays of detachably connected consumable parts along a first direction, stacking the arrays of detachably connected consumable parts along a second direction and bonding the stacked arrays of detachably connected consumable parts at an outer surface formed by one or more aligned marginal surfaces of the detachably connected consumable parts. In one embodiment, a staple refill includes a number of staple wire sheets stacked along a direction normal to a plane of each of the staple wire sheets. The staple wire sheets are bonded at an outer surface formed by one or more aligned marginal surfaces of the plurality of staple wires.
    Type: Grant
    Filed: May 11, 2004
    Date of Patent: April 10, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Roberto Obregon, Marina M. Talavera
  • Publication number: 20040206447
    Abstract: The present invention is directed to a device and method for building a consumable refill that includes the steps of fabricating a plurality of arrays of detachably connected consumable parts along a first direction, stacking the arrays of detachably connected consumable parts along a second direction and bonding the stacked arrays of detachably connected consumable parts at an outer surface formed by one or more aligned marginal surfaces of the detachably connected consumable parts. In one embodiment, a staple refill includes a number of staple wire sheets stacked along a direction normal to a plane of each of the staple wire sheets. The staple wire sheets are bonded at an outer surface formed by one or more aligned marginal surfaces of the plurality of staple wires.
    Type: Application
    Filed: May 11, 2004
    Publication date: October 21, 2004
    Inventors: Roberto Obregon, Marina M. Talavera
  • Patent number: 6736922
    Abstract: The present invention is directed to a system and method for building a consumable part refill, which may be a staple refill, the method comprising the steps of fabricating an array of consumable parts detachably connected along a first direction, stacking a plurality of such fabricated arrays of parts, or staple wire plates, along a second direction, and providing an adhesive bond between adjacent ones of this stacked plurality of arrays.
    Type: Grant
    Filed: October 11, 2001
    Date of Patent: May 18, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Roberto Obregon, Marina M. Talavera
  • Publication number: 20030072637
    Abstract: The present invention is directed to a system and method for building a consumable part refill, which may be a staple refill, the method comprising the steps of fabricating an array of consumable parts detachably connected along a first direction, stacking a plurality of such fabricated arrays of parts, or staple wire plates, along a second direction, and providing an adhesive bond between adjacent ones of this stacked plurality of arrays.
    Type: Application
    Filed: October 11, 2001
    Publication date: April 17, 2003
    Inventors: Roberto Obregon, Marina M. Talavera