Abstract: A method for correctly positioning a metallic plate supporting a semiconductor chip in a mold used for encapsulation, wherein according to a first solution, at least a pair of retractable locating pins are utilized together with a lead connected to the supporting plate. The ends of the locating pins are retracted in the final phase of encapsulation, from the surfaces of the plate, whereas in the initial phase they are in direct contact with the surfaces. According to a second solution, a pair of clamping pins are indirectly connected to the plate through the interposition of insulating thicknessings.

Abstract: An integrated circuit package having a semiconductor integrated circuit chip thermally and mechanically coupled to a cooling plate is described. The leadframe conductors for the package have bent end portions to bring the conductors in close proximity to the integrated circuit chip. The bent end portions of the leadframe conductors are coated with an electrically insulating material such as a varnish comprising a Teflon-based lacquer with suitable high temperature properties for permitting mechanical and thermal contact of the leadframe conductors to the heat sink or the cooling plate without electrical connection thereto. One of the leadframe conductors is adapted to engage an aperture in the cooling plate to provide a positioning mechanism and increased mechanical connection between the leadframe conductors and the cooling plate. By configuring the leadframe in an appropriate manner, conducting wires can be coupled to the chip on three sides thereof from the bent end portions of the leadframe conductors.

Abstract: A container for a semiconductor device has a metal plate and a body of synthetic resin which encapsulates a part of the plate, keeping a large surface thereof exposed. In the area separating the part encapsulated within the body of resin and the part without the resin, the plate has two opposed side notches and at least one groove connecting them.

Abstract: A heat-dissipating metal bar to be imbedded in a molded body of plastic material, together with a punched metal foil forming an array of conductor strips to be soldered to a silicon chip, has a large exposed surface and is provided on its opposite surface with projections passing through cutouts in the foil. Upon the molding of the resinous body around the bar, portions of the foil and the silicon chip, one of the mold halves bears upon these projections while the other mold half comes to rest against the exposed bar surface which is thereby pressed into firm contact with that mold half to prevent the intrusion of any resin therebetween. The mold-closing pressure deforms the tips of the projections to help anchor the bar to the resinous body.