Patents by Inventor Mario Dagio CORNEJO

Mario Dagio CORNEJO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11980992
    Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.
    Type: Grant
    Filed: September 16, 2022
    Date of Patent: May 14, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Ashavani Kumar, Ashwin Chockalingam, Sivapackia Ganapathiappan, Rajeev Bajaj, Boyi Fu, Daniel Redfield, Nag B. Patibandla, Mario Dagio Cornejo, Amritanshu Sinha, Yan Zhao, Ranga Rao Arnepalli, Fred C. Redeker
  • Publication number: 20230052048
    Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.
    Type: Application
    Filed: September 16, 2022
    Publication date: February 16, 2023
    Inventors: Ashavani KUMAR, Ashwin CHOCKALINGAM, Sivapackia GANAPATHIAPPAN, Rajeev BAJAJ, Boyi FU, Daniel REDFIELD, Nag B. PATIBANDLA, Mario Dagio CORNEJO, Amritanshu SINHA, Yan ZHAO, Ranga Rao ARNEPALLI, Fred C. REDEKER
  • Patent number: 11471999
    Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: October 18, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Ashavani Kumar, Ashwin Chockalingam, Sivapackia Ganapathiappan, Rajeev Bajaj, Boyi Fu, Daniel Redfield, Nag B. Patibandla, Mario Dagio Cornejo, Amritanshu Sinha, Yan Zhao, Ranga Rao Arnepalli, Fred C. Redeker
  • Publication number: 20210347005
    Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material and methods of forming thereof. In one embodiment, a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition, and the dispensed window precursor composition disposed within the first layer.
    Type: Application
    Filed: July 21, 2021
    Publication date: November 11, 2021
    Inventors: Boyi FU, Sivapackia GANAPATHIAPPAN, Daniel REDFIELD, Rajeev BAJAJ, Ashwin CHOCKALINGAM, Dominic J. BENVEGNU, Mario Dagio CORNEJO, Mayu YAMAMURA, Nag B. PATIBANDLA, Ankit VORA
  • Patent number: 11072050
    Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition and the dispensed window precursor composition disposed within the first layer.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: July 27, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Boyi Fu, Sivapackia Ganapathiappan, Daniel Redfield, Rajeev Bajaj, Ashwin Chockalingam, Dominic J. Benvegnu, Mario Dagio Cornejo, Mayu Yamamura, Nag B. Patibandla, Ankit Vora
  • Publication number: 20190047112
    Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition and the dispensed window precursor composition disposed within the first layer.
    Type: Application
    Filed: July 31, 2018
    Publication date: February 14, 2019
    Inventors: Boyi FU, Sivapackia GANAPATHIAPPAN, Daniel REDFIELD, Rajeev BAJAJ, Ashwin CHOCKALINGAM, Dominic J. BENVEGNU, Mario Dagio CORNEJO, Mayu YAMAMURA, Nag B. PATIBANDLA, Ankit VORA
  • Publication number: 20190030678
    Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.
    Type: Application
    Filed: July 23, 2018
    Publication date: January 31, 2019
    Inventors: Ashavani KUMAR, Ashwin CHOCKALINGAM, Sivapackia GANAPATHIAPPAN, Rajeev BAJAJ, Boyi FU, Daniel REDFIELD, Nag B. PATIBANDLA, Mario Dagio CORNEJO, Amritanshu SINHA, Yan ZHAO, Ranga Rao ARNEPALLI, Fred C. REDEKER