Patents by Inventor Mario David Silvetti
Mario David Silvetti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11173579Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.Type: GrantFiled: June 25, 2018Date of Patent: November 16, 2021Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Mario David Silvetti, Yin Yuan, Samuel Chu-Chiang Hsu, Huanbo Zhang, Gautam Shashank Dandavate
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Publication number: 20180304441Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.Type: ApplicationFiled: June 25, 2018Publication date: October 25, 2018Inventors: Hung Chih Chen, Mario David Silvetti, Yin Yuan, Samuel Chu-Chiang Hsu, Huanbo Zhang, Gautam Shashank Dandavate
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Patent number: 9812344Abstract: A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.Type: GrantFiled: February 3, 2015Date of Patent: November 7, 2017Assignee: Applied Materials, Inc.Inventors: Jason Rye, Mario David Silvetti, Randy A. Harris, Bryan Puch, Vincent Steffan Francischetti, Satish Sundar
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Publication number: 20160240405Abstract: A high throughput stand-alone anneal system has a horizontal row of docking stations at a front wall of an enclosure. A rack in the enclosure has a plurality of vertically stacked anneal modules. Robots within the enclosure move wafers from the docking stations to one of the anneal modules for rapid thermal anneal processing.Type: ApplicationFiled: February 12, 2015Publication date: August 18, 2016Inventors: Vincent Steffan Francischetti, Robert B. Moore, Mario David Silvetti, Roey Shaviv
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Publication number: 20160225656Abstract: A wafer processing system has a ring maintenance module for loading wafers into a chuck assembly, and for cleaning and inspecting the chuck assembly used in electroplating processors of the system. A shaft is attached to a rotor plate. A rotation motor rotates the shaft and a rotor plate on the shaft. A chuck clamp on an upper end of the shaft holds the chuck assembly onto the rotor plate. A lift motor raises and lowers the rotor plate and the shaft, to move open the chuck assembly for wafer loading and unloading, and to move the chuck assembly into different process positions. A swing arm having spray nozzles may be provided for cleaning the chuck assembly.Type: ApplicationFiled: February 3, 2015Publication date: August 4, 2016Inventors: Jason Rye, Mario David Silvetti, Randy A. Harris, Bryan Puch, Vincent Steffan Francischetti, Satish Sundar
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Publication number: 20120034848Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.Type: ApplicationFiled: August 5, 2011Publication date: February 9, 2012Inventors: Hung Chih Chen, Mario David Silvetti, Yin Yuan
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Patent number: 7997851Abstract: A new apparatus for processing substrates is disclosed. A multi-level load lock chamber having four environmentally isolated chambers interfaces with a transfer chamber that has a robotic assembly. The robotic assembly has two arms that each can move horizontally as the robotic assembly rotates about its axis. The arms can reach into the isolated chambers of the load lock to receive substrates from the bottom isolated chambers, transport the substrates to process chambers, and then place the substrates in the upper chambers. The isolated chambers in the load lock chamber may have a pivotably attached lid that may be opened to access the inside of the isolated chambers.Type: GrantFiled: October 23, 2008Date of Patent: August 16, 2011Assignee: Applied Materials, Inc.Inventors: Robert B. Moore, Eric Ruhland, Satish Sundar, Mario David Silvetti
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Publication number: 20100145513Abstract: A robotic positioning system that cooperates with a sensing system to correct robot motion is provided. The sensing system is decoupled from the sensors used conventionally to control the robot's motion, thereby providing repeatable detection of the robot's true position. In one embodiment, the positioning system includes a robot, a controller, a motor sensor and a decoupled sensor. The robot has at least one motor for manipulating a linkage controlling the displacement of a substrate support coupled thereto. The motor sensor is provides the controller with motor actuation information utilized to move the substrate support. The decoupled sensor provides information indicative of the true position the substrate support that may be utilized to correct the robot's motion.Type: ApplicationFiled: February 24, 2010Publication date: June 10, 2010Applicant: APPLIED MATERIALS, INC.Inventors: Pyongwon Yim, Satish Sundar, Vinay Shah, Mario David Silvetti, Douglas Kitajima, Venkatesh Babu, Visweswaren Sivaramakrishnan, Indrajit Lahiri, Surinder Bedi
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Patent number: 7695232Abstract: A new apparatus for processing substrates is disclosed. A multi-level load lock chamber having four environmentally isolated chambers interfaces with a transfer chamber that has a robotic assembly. The robotic assembly has two arms that each can move horizontally as the robotic assembly rotates about its axis. The arms can reach into the isolated chambers of the load lock to receive substrates from the bottom isolated chambers, transport the substrates to process chambers, and then place the substrates in the upper chambers. The isolated chambers in the load lock chamber may have a pivotably attached lid that may be opened to access the inside of the isolated chambers.Type: GrantFiled: June 15, 2006Date of Patent: April 13, 2010Assignee: Applied Materials, Inc.Inventors: Robert B. Moore, Eric Ruhland, Satish Sundar, Mario David Silvetti
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Patent number: 7582167Abstract: In one embodiment, the invention is a guard ring for reducing particle entrapment along a moveable shaft of a substrate support. In one embodiment, the guard ring comprises a substantially annular guard ring positioned within a step formed in a sleeve that circumscribes the shaft. The guard ring is positioned to substantially seal a gap separating the shaft from the sleeve, so that the amount of particles and foreign matter that travel within or become trapped in the gap is substantially reduced. In another embodiment, a guard ring comprises a base portion having an inner perimeter and an outer perimeter, a first flange coupled to the inner perimeter, a second flange coupled to the outer perimeter, and a continuous channel separating the first flange from the second flange. The first flange is adapted to function as a spring that accommodates displacement of the shaft.Type: GrantFiled: October 3, 2007Date of Patent: September 1, 2009Assignee: Applied Materials, Inc.Inventors: Andrzej Kaszuba, Sophia M. Velastegui, Visweswaren Sivaramakrishnan, Pyongwon Yim, Mario David Silvetti, Tom K. Cho, Indrajit Lahiri, Surinder S. Bedi
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Publication number: 20090092466Abstract: A new apparatus for processing substrates is disclosed. A multi-level load lock chamber having four environmentally isolated chambers interfaces with a transfer chamber that has a robotic assembly. The robotic assembly has two arms that each can move horizontally as the robotic assembly rotates about its axis. The arms can reach into the isolated chambers of the load lock to receive substrates from the bottom isolated chambers, transport the substrates to process chambers, and then place the substrates in the upper chambers. The isolated chambers in the load lock chamber may have a pivotably attached lid that may be opened to access the inside of the isolated chambers.Type: ApplicationFiled: October 23, 2008Publication date: April 9, 2009Inventors: Robert B. Moore, Eric Ruhland, Satish Sundar, Mario David Silvetti
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Publication number: 20090068356Abstract: Embodiments of the present invention are generally directed to apparatus and methods for a plasma-processing chamber requiring less maintenance and downtime and possessing improved reliability over the prior art. In one embodiment, the apparatus includes a substrate support resting on a ceramic shaft, an inner shaft allowing for electrical connections to the substrate support at atmospheric pressure, an aluminum substrate support resting on but not fixed to a ceramic support structure, sapphire rest points swaged into the substrate support, and a heating element inside the substrate support arranged in an Archimedes spiral to reduce warping of the substrate support and to increase its lifetime. Methods include increasing time between in-situ cleans of the chamber by reducing particle generation from chamber surfaces. Reduced particle generation occurs via temperature control of chamber components and pressurization of non-processing regions of the chamber relative to the processing region with a purge gas.Type: ApplicationFiled: October 22, 2008Publication date: March 12, 2009Inventors: MARIO David SILVETTI, David H. Quach, Bok Hoen Kim, Thomas Nowak, Thomas K. Cho, Fred H. Hariz, Robert B. Moore
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Patent number: 7374391Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks.Type: GrantFiled: December 22, 2005Date of Patent: May 20, 2008Assignee: Applied Materials, Inc.Inventors: Michael Rice, Jeffrey Hudgens, Charles Carlson, William Tyler Weaver, Robert Lowrance, Eric Englhardt, Dean C. Hruzek, Mario David Silvetti, Michael Kuchar, Kirk Van Katwyk, Van Hoskins, Vinay Shah
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Patent number: 7374393Abstract: A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks.Type: GrantFiled: April 5, 2006Date of Patent: May 20, 2008Assignee: Applied Materials, Inc.Inventors: Mike Rice, Jeffrey Hudgens, Charles Carlson, William Tyler Weaver, Robert Lowrance, Eric Englhardt, Dean C. Hruzek, Mario David Silvetti, Michael Kuchar, Kirk Van Katwyk, Van Hoskins, Vinay Shah
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Publication number: 20070292244Abstract: A new apparatus for processing substrates is disclosed. A multi-level load lock chamber having four environmentally isolated chambers interfaces with a transfer chamber that has a robotic assembly. The robotic assembly has two arms that each can move horizontally as the robotic assembly rotates about its axis. The arms can reach into the isolated chambers of the load lock to receive substrates from the bottom isolated chambers, transport the substrates to process chambers, and then place the substrates in the upper chambers. The isolated chambers in the load lock chamber may have a pivotably attached lid that may be opened to access the inside of the isolated chambers.Type: ApplicationFiled: June 15, 2006Publication date: December 20, 2007Inventors: ROBERT B. MOORE, Eric Ruhland, Satish Sundar, Mario David Silvetti
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Patent number: 7279049Abstract: In one embodiment, the invention is a guard ring for reducing particle entrapment along a moveable shaft of a substrate support. In one embodiment, the guard ring comprises a substantially annular guard ring positioned within a step formed in a sleeve that circumscribes the shaft. The guard ring is positioned to substantially seal a gap separating the shaft from the sleeve, so that the amount of particles and foreign matter that travel within or become trapped in the gap is substantially reduced. In another embodiment, a guard ring comprises a base portion having an inner perimeter and an outer perimeter, a first flange coupled to the inner perimeter, a second flange coupled to the outer perimeter, and a continuous channel separating the first flange from the second flange. The first flange is adapted to function as a spring that accommodates displacement of the shaft.Type: GrantFiled: February 5, 2004Date of Patent: October 9, 2007Assignee: Applied Materials, Inc.Inventors: Andrzej Kaszuba, Sophia M. Velastegui, Visweswaren Sivaramakrishnan, Pyongwon Yim, Mario David Silvetti, Tom K. Cho, Indrajit Lahiri, Surinder S. Bedi
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Patent number: 7107125Abstract: A robotic positioning system that cooperates with a sensing system to correct robot motion is provided. The sensing system is decoupled from the sensors used conventionally to control the robot's motion, thereby providing repeatable detection of the robot's true position. In one embodiment, the positioning system includes a robot, a controller, a motor sensor and a decoupled sensor. The robot has at least one motor for manipulating a linkage controlling the displacement of a substrate support coupled thereto. The motor sensor is provides the controller with motor actuation information utilized to move the substrate support. The decoupled sensor provides information indicative of the true position the substrate support that may be utilized to correct the robot's motion.Type: GrantFiled: October 29, 2003Date of Patent: September 12, 2006Assignee: Applied Materials, Inc.Inventors: Pyongwon Yim, Satish Sundar, Vinay Shah, Mario David Silvetti, Douglas Kitajima, Venkatesh Babu, Visweswaren Sivaramakrishnan, Indrajit Lahiri, Surinder Bedi
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Patent number: 7094313Abstract: A substrate processing system is provided with a processing chamber, an alternating voltage supply, and an impedance matching network. The processing chamber holds a substrate during processing and the alternating voltage supply is connected with the processing chamber to capacitively couple energy to a plasma formed within the processing chamber. The impedance matching network is coupled with the alternating voltage supply and has a variable resistive element and a variable reactive element, whose states respectively define distinct real and imaginary parts of an impedance.Type: GrantFiled: April 21, 2004Date of Patent: August 22, 2006Assignee: Applied Materials, Inc.Inventors: Eller Y. Juco, Visweswaren Sivaramakrishnan, Mario David Silvetti, Talex Sajoto
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Patent number: 7024105Abstract: A substrate heater assembly for supporting a substrate of a predetermined standardized diameter during processing is provided. In one embodiment, the substrate heater assembly includes a body having an upper surface, a lower surface and an embedded heating element. A substrate support surface is formed in the upper surface of the body and defines a portion of a substrate receiving pocket. An annular wall is oriented perpendicular to the upper surface and has a length of at least one half a thickness of the substrate. The wall bounds an outer perimeter of the substrate receiving pocket and has a diameter less than about 0.5 mm greater than the predetermined substrate diameter.Type: GrantFiled: October 10, 2003Date of Patent: April 4, 2006Assignee: Applied Materials Inc.Inventors: Mark A. Fodor, Sophia M. Velastegui, Soovo Sen, Visweswaren Sivaramakrishnan, Peter Wai-Man Lee, Mario David Silvetti
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Patent number: 6911403Abstract: A method for depositing an organosilicate layer on a substrate includes varying one or more processing conditions during a process sequence for depositing an organosilicate layer from a gas mixture comprising an organosilicon compound in the presence of RF power in a processing chamber. In one aspect, the distance between the substrate and a gas distribution manifold in the processing chamber is varied during processing. Preferably, the method of depositing an organosilicate layer minimizes plasma-induced damage to the substrate.Type: GrantFiled: August 20, 2003Date of Patent: June 28, 2005Assignee: Applied Materials, Inc.Inventors: Lihua Li, Tsutomu Tanaka, Tzu-Fang Huang, Li-Qun Xia, Dian Sugiarto, Visweswaren Sivaramakrishnan, Peter Wai-Man Lee, Mario David Silvetti