Patents by Inventor Mario Di Giovanni

Mario Di Giovanni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4241325
    Abstract: A displacement transducer comprises a rigid support, a flexible diaphragm having a periphery attached to the support, and an interior free to deflect, and a strain sensor on the diaphragm. The diaphragm has a circular periphery and a plurality of concentric annular corrugations coaxial with the periphery. A first pair of strain gauges sense the tangential strain on one of the crests of the corrugations and a second pair of strain gauges sense the tangential strain in one of the troughs of the corrugations. The strain gauges are connected in an electrical bridge to provide a displacement representative output.
    Type: Grant
    Filed: March 21, 1979
    Date of Patent: December 23, 1980
    Assignee: Micro Gage, Inc.
    Inventor: Mario Di Giovanni
  • Patent number: 4135408
    Abstract: A differential pressure transducer assembly which indicates pressure differences while remaining insensitive to variations in line pressure and overload pressure. The assembly has a transducer consisting of a semi-conductor sensor isolated from the medium being measured by mounting it on a resilient diaphragm between two small hydraulic chambers. The chambers are closed with a pair of diaphragms which isolate the two chambers from the external environment. The transducer sensor is comprised of a silicon chip having a large center boss area which is supported by a silicon back plate of similar material fused to the silicon chip at the periphery. The back plate is mounted by a hollow support stud to a threaded hub at the center of the resilient diaphragm separating the chambers. A space between the silicon chip and back plate communicates with the hydraulic fluid of one chamber through an inlet in the support stud. The opposite side of the silicon chip is immersed in the hydraulic fluid of the other chamber.
    Type: Grant
    Filed: June 15, 1977
    Date of Patent: January 23, 1979
    Assignee: ICT Instruments, Inc.
    Inventor: Mario Di Giovanni