Patents by Inventor Mario G. Sepulveda
Mario G. Sepulveda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10074944Abstract: A circuit includes a connector having first and second mateable portions. Each portion includes at least two terminals configured to mechanically engage at least two terminals of the other portion. The two terminals within the first and second portions are arranged so that as the first and second portions are mated, a first terminal of the first portion and a first terminal of the second portions come into contact before respective second terminals of the first and second portions. The circuit also includes a polymeric positive temperature coefficient (PPTC) device with a first terminal in electrical communication with the first terminal of the first portion and a second terminal in electrical communication with the second terminal of the first portion. A power terminal is in electrical communication with the second terminal of the first portion and is configured to be connected to a power source.Type: GrantFiled: March 21, 2016Date of Patent: September 11, 2018Assignee: Littelfuse, Inc.Inventors: Kedar V. Bhatawadekar, Mario G. Sepulveda, Jason Larson
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Publication number: 20170271824Abstract: A circuit includes a connector having first and second mateable portions. Each portion includes at least two terminals configured to mechanically engage at least two terminals of the other portion. The two terminals within the first and second portions are arranged so that as the first and second portions are mated, a first terminal of the first portion and a first terminal of the second portions come into contact before respective second terminals of the first and second portions. The circuit also includes a polymeric positive temperature coefficient (PPTC) device with a first terminal in electrical communication with the first terminal of the first portion and a second terminal in electrical communication with the second terminal of the first portion. A power terminal is in electrical communication with the second terminal of the first portion and is configured to be connected to a power source.Type: ApplicationFiled: March 21, 2016Publication date: September 21, 2017Applicant: Littelfuse, Inc.Inventors: Kedar V. Bhatawadekar, Mario G. Sepulveda, Jason Larson
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Patent number: 9659690Abstract: A method of manufacturing a surface mount device includes providing at least one core device and at least one lead frame. The core device is attached to the lead frame. The core device and the lead frame are encapsulated within an encapsulant. The encapsulant comprises a liquid epoxy that when cured has an oxygen permeability of less than approximately 0.4 cm3·mm/m2·atm·day.Type: GrantFiled: October 14, 2014Date of Patent: May 23, 2017Assignee: Littelfuse, Inc.Inventors: Mario G. Sepulveda, Martin G. Pineda, Anthony Vranicar, Kedar V. Bhatawadekar, Minh V. Ngo, Dov Nitzan
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Patent number: 9646746Abstract: An electrical device having first and second electrodes and a layer of a conductive composite electrically in contact with the first and second electrodes. The conductive composite is a mixture of a semi-crystalline polymer and a conductive filler, the conductive filler including a plurality of particles containing an inner material including a first metal; and an outer material surrounding the inner material, the outer material including a second metal; and an intermetallic compound formed between the inner material and the outer material. The intermetallic compound has features from the inner material and the outer material. The device can be a circuit protection device. Also provided is a method of making a conductive composite by dry mixing the components.Type: GrantFiled: July 10, 2015Date of Patent: May 9, 2017Assignee: ITTELFUSE, INC.Inventors: Jaydip Das, Ting Gao, Nicola Pugliano, Mark F. Wartenberg, Diane G. Bigler, Mario G. Sepulveda, Kavitha Bharadwaj, Richard B. Lloyd
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Patent number: 9646744Abstract: A method of manufacturing a surface mount device includes forming a plaque from a material, forming a plurality of conductive protrusions on a top surface and a bottom surface of the plaque, and applying a liquid encapsulant over at least a portion of the top surface and at least a portion of the bottom surface of the plaque. The liquid encapsulant is cured and when cured encapsulant has an oxygen permeability of less than about 0.4 cm3·mm/m2·atm·day. The assembly is cut to provide a plurality of components. After cutting, the top surface of each component includes at least one conductive protrusion, the bottom surface of each component includes at least one conductive protrusion, the top surface and the bottom surface of each component include the cured encapsulant, and a core of each component includes the material.Type: GrantFiled: October 14, 2014Date of Patent: May 9, 2017Assignee: LITTELFUSE, INC.Inventors: Mario G. Sepulveda, Martin G. Pineda, Anthony Vranicar, Kedar V. Bhatawadekar, Minh V. Ngo, Dov Nitzan
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Publication number: 20160104559Abstract: A method of manufacturing a surface mount device includes forming a plaque from a material, forming a plurality of conductive protrusions on a top surface and a bottom surface of the plaque, and applying a liquid encapsulant over at least a portion of the top surface and at least a portion of the bottom surface of the plaque. The liquid encapsulant is cured and when cured encapsulant has an oxygen permeability of less than about 0.4 cm3·mm/m2·atm·day. The assembly is cut to provide a plurality of components. After cutting, the top surface of each component includes at least one conductive protrusion, the bottom surface of each component includes at least one conductive protrusion, the top surface and the bottom surface of each component include the cured encapsulant, and a core of each component includes the material.Type: ApplicationFiled: October 14, 2014Publication date: April 14, 2016Applicant: Tyco Electronics CorporationInventors: Mario G. Sepulveda, Martin G. Pineda, Anthony Vranicar, Kedar V. Bhatawadekar, Minh V. Ngo, Dov Nitzan
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Publication number: 20160105965Abstract: A method of manufacturing a surface mount device includes providing at least one core device and at least one lead frame. The core device is attached to the lead frame. The core device and the lead frame are encapsulated within an encapsulant. The encapsulant comprises a liquid epoxy that when cured has an oxygen permeability of less than approximately 0.4 cm3•mm/m2•atm•day.Type: ApplicationFiled: October 14, 2014Publication date: April 14, 2016Applicant: Tyco Electronics CorporationInventors: Mario G. Sepulveda, Martin G. Pineda, Anthony Vranicar, Kedar V. Bhatawadekar, Minh V. Ngo, Dov Nitzan
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Publication number: 20160042845Abstract: An electrical device having first and second electrodes and a layer of a conductive composite electrically in contact with the first and second electrodes. The conductive composite is a mixture of a semi-crystalline polymer and a conductive filler, the conductive filler including a plurality of particles containing an inner material including a first metal; and an outer material surrounding the inner material, the outer material including a second metal; and an intermetallic compound formed between the inner material and the outer material. The intermetallic compound has features from the inner material and the outer material. The device can be a circuit protection device. Also provided is a method of making a conductive composite by dry mixing the components.Type: ApplicationFiled: July 10, 2015Publication date: February 11, 2016Applicant: Tyco Electronics CorporationInventors: Jaydip Das, Ting Gao, Nicola Pugliano, Mark F. Wartenberg, Diane G. Bigler, Mario G. Sepulveda, Kavitha Bharadwaj, Richard B. Lloyd
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Publication number: 20120307467Abstract: An electrical component includes a plurality of core devices arranged within a housing so as to be electrically isolated from one another. For each of the plurality of core devices, a first contact pad and a second contact pad is formed on an outside surface of the housing. The first and second contact pads are electrically connected to a respective core device of the plurality of core devices.Type: ApplicationFiled: June 3, 2011Publication date: December 6, 2012Inventors: Luis A. Navarro, Mario G. Sepulveda, Patrick J. Hibbs, Martin G. Pineda, Martyn A. Matthiesen, Anthony Vranicar, Dong Yu