Abstract: A method of manufacturing a printed circuit board is providedd, comprising: 1) imprinting an electrically conductive circuit pattern on a surface of a substrate; 2) applying a surface treatment composition to the surface of the substrate over the electrically conductive circuit pattern; and 3) allowing the surface treatment composition to form a self-assembled coating layer on the surface of the substrate in the form of a conformal coating. The surface treatment composition comprises: (a) a fluorine-containing polymer; (b) a solvent containing at least one C-F bond; and (c) a rheology modifying component. Also provided are electronic compoennts of a circuit assembly and printed circuit boards, comprising a substrate and a self-assembled coating layer applied to at least one surface of the substrate. The coating layer is in the form of a conformal coating and is formed from the surface treatment composition described above.

Abstract: Surface treatment compositions are provided comprising: (a) a fluorine-containing polymer; (b) a solvent containing at least one C—F bond; and (c) a rheology modifying component. Also provided are coated articles, comprising: (i) a substrate; and (ii) a self-assembled coating layer applied to at least one surface of the substrate. The self-assembled coating layer is formed from the surface treatment composition above.

Abstract: The invention is based on the discovery that certain well-defined b-stageable adhesives are useful in stacked die assemblies. In particular, the invention provides assemblies wherein the b-stageable adhesive encapsulates a portion of the wiring members contained within the bondline gap between the stacked die. In other words, the b-stageable adhesive has the ability to flow through (i.e., encapsulate) the wires as the adhesive fills the bondline gap, thereby preventing any mold compound from covering the wires.