Patents by Inventor Mario Giuseppe PAVONE

Mario Giuseppe PAVONE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230104798
    Abstract: A pressure sensor including: a structure which delimits a main cavity of a closed type, the structure being at least partially deformable as a function of a pressure external to the structure; and a MEMS device, which is arranged in the main cavity and generates an output signal, which is of an electrical type and is indicative of the pressure inside the main cavity.
    Type: Application
    Filed: November 30, 2022
    Publication date: April 6, 2023
    Applicant: STMICROELECTRONICS S.r.l.
    Inventor: Mario Giuseppe PAVONE
  • Patent number: 11535508
    Abstract: A pressure sensor including: a structure which delimits a main cavity of a closed type, the structure being at least partially deformable as a function of a pressure external to the structure; and a MEMS device, which is arranged in the main cavity and generates an output signal, which is of an electrical type and is indicative of the pressure inside the main cavity.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: December 27, 2022
    Assignee: STMICROELECTRONICS S.r.l.
    Inventor: Mario Giuseppe Pavone
  • Publication number: 20200270118
    Abstract: A pressure sensor including: a structure which delimits a main cavity of a closed type, the structure being at least partially deformable as a function of a pressure external to the structure; and a MEMS device, which is arranged in the main cavity and generates an output signal, which is of an electrical type and is indicative of the pressure inside the main cavity.
    Type: Application
    Filed: February 24, 2020
    Publication date: August 27, 2020
    Inventor: Mario Giuseppe PAVONE
  • Patent number: 9983084
    Abstract: A pressure sensing assembly includes: a substrate; a pressure sensor on the substrate; a package, the substrate and the pressure sensor being embedded in the package; and a pressure adapter, with a first interface, external to the package and having a first area, and a second interface, coupled to the pressure sensor and having a second area, different from the first area. The pressure adapter is configured to transfer a force between the first interface and the second interface so that a pressure on the second interface is different from a pressure on the first interface.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: May 29, 2018
    Assignee: STMICROELECTRONICS S.R.L.
    Inventor: Mario Giuseppe Pavone
  • Publication number: 20170234753
    Abstract: A pressure sensing assembly includes: a substrate; a pressure sensor on the substrate; a package, the substrate and the pressure sensor being embedded in the package; and a pressure adapter, with a first interface, external to the package and having a first area, and a second interface, coupled to the pressure sensor and having a second area, different from the first area. The pressure adapter is configured to transfer a force between the first interface and the second interface so that a pressure on the second interface is different from a pressure on the first interface.
    Type: Application
    Filed: June 7, 2016
    Publication date: August 17, 2017
    Inventor: Mario Giuseppe PAVONE