Patents by Inventor Mark A. Bergquist

Mark A. Bergquist has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11644986
    Abstract: A Data Storage Device (DSD) includes at least one Non-Volatile Memory (NVM) configured to store data and a Non-Volatile Cache (NVC). Write data is stored in a volatile memory in preparation for writing the write data in the at least one NVM. In response to a power loss of the DSD, at least a portion of the data stored in the volatile memory is transferred from the volatile memory to the NVC and one or more parameters are determined for deriving a margin representing an additional amount of data for transfer from the volatile memory to the NVC using a remaining power following a power loss. A size of the NVC is adjusted based at least in part on the derived margin.
    Type: Grant
    Filed: November 20, 2021
    Date of Patent: May 9, 2023
    Assignee: Western Digital Technologies, Inc.
    Inventors: Bernd Lamberts, Shad H. Thorstenson, Andrew Larson, Mark Bergquist
  • Patent number: 5790341
    Abstract: A method and apparatus is provided which introduces a relative skew between a servo pattern and a magneto-resistive (MR) head in order to reduce interference introduced by inductive reading of shields formed as part of the MR head. The relative skew may be accomplished by introducing a skew angle directly on the head or by skewing the servo pattern formed on the magnetic medium relative to the head. Various skewed patterns may be used to reduce the overall interference.
    Type: Grant
    Filed: September 20, 1995
    Date of Patent: August 4, 1998
    Assignee: International Business Machines Corporation
    Inventors: Earl A. Cunningham, Jodie A. Christner, Thomas C. Christensen, David T. Flynn, Mark A. Bergquist, Mark D. Hagen
  • Patent number: 5184284
    Abstract: Engineering changes (EC) for an integrated-circuit (IC) module or circuits connected to an IC module sometimes require the addition of discrete electrical components or circuit chips. Such engineering changes are implemented herein on a small printed circuit card or board that may be physically attached to the top of the IC module. The EC pads on the printed circuit EC card are juxtaposed with the IC module input/output (I/O) pins that require the engineering change. A short fly wire is then soldered between each juxtaposed EC pad and the I/O pin to make the electrical connection between the EC card and the module. In this way, no additional surface area is consumed on the printed circuit board on which the module is mounted.
    Type: Grant
    Filed: September 3, 1991
    Date of Patent: February 2, 1993
    Assignee: International Business Machines Corporation
    Inventors: Brian T. Ashelin, Mark A. Bergquist, Dennis E. Noltee, Sr.