Abstract: An activatable adhesive that is formulated to readily absorb energy from a given radiation source, an activatable adhesive label that incorporates such an activatable adhesive, a system for activating such labels, and related methods and uses are described. The activatable adhesive includes a plasticizer, a tackifier, and an adhesive base polymer that includes butyl acrylate, styrene, methyl methacrylate, methacrylic acid, and acrylic acid.

Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.

Abstract: An activatable adhesive that is formulated to readily absorb energy from a given radiation source, an activatable adhesive label that incorporates such an activatable adhesive, a system for activating such labels, and related methods and uses are described. The activatable adhesive includes a plasticizer, a tackifier, and an adhesive base polymer that includes butyl acrylate, styrene, methyl methacrylate, methacrylic acid, and acrylic acid.

Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.

Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.

Abstract: An activatable adhesive that is formulated to readily absorb energy from a given radiation source, an activatable adhesive label that incorporates such an activatable adhesive, a system for activating such labels, and related methods and uses are described. The activatable adhesive includes a plasticizer, a tackifier, and an adhesive base polymer that includes butyl acrylate, styrene, methyl methacrylate, methacrylic acid, and acrylic acid.

Abstract: A system is disclosed for printing, activating and applying a flow of linerless activatable labels to a flow of items to be labeled. An activatable adhesive is formulated to readily absorb energy from a given radiation source, an activatable adhesive linerless label incorporates such the activatable adhesive. Related methods and uses are described. The activatable adhesive includes a plasticizer, a tackifier, and an adhesive base polymer that includes butyl acrylate, styrene, methyl methacrylate, methacrylic acid, and acrylic acid.

Abstract: An activatable adhesive that is formulated to readily absorb energy from a given radiation source, an activatable adhesive label that incorporates such an activatable adhesive, a system for activating such labels, and related methods and uses are described. The activatable adhesive includes a plasticizer, a tackifier, and an adhesive base polymer that includes butyl acrylate, styrene, methyl methacrylate, methacrylic acid, and acrylic acid.

Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.

Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.

Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.

Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.

Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.

Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.

Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.

Abstract: A combinatorial, high-throughput screening method is described for developing new coatings having a performance characteristic of a coating property which results in a substantial increase in the discovery rate of new coating materials. The method includes the steps of providing an array of wells (18) for receiving candidate coating materials having a parameter; placing coating materials in each well (16) while varying the coating material parameter correlating the coating material position in the array to the variation of the coating material parameter; applying a coating leveling force to and optionally drying the coating materials in the array of coating wells (19); testing the coatings with regard to the desired performance characteristic (21) and correlating the result of the test to the well position in the array that thereby coating materials having the desired performance characteristic may be discovered.

Abstract: A continuous process for manufacturing self-assembled multilayer coatings, and more particularly, to a continuous process for making multilayer coatings in a roll-to-roll process. A predetermined number of alternating nanoscopic layers of positively charged and negatively charges species are deposited on a moving substrate to form a multilayer composite coating on a substrate in roll form.

Abstract: One aspect of the invention relates to a new dual-layered construction that provides advantageous oxygen barrier properties. Another aspect of the invention is a multilayer film that has advantageous oxygen and/or moisture barrier properties. The film may be fully-organic. The film may also be primarily water-based. At least some embodiments of the film can be produced using wide-web, roll-to-roll processing. Specific example applications for uses of the film include dried food, pharmaceuticals, liquids, lidstock, cheese, meat, health & beauty, and coffee packaging, among many others. Another aspect of the invention is a water-based, fast curing coating composition that provides a high barrier against oxygen and moisture permeation. In one embodiment, the coating comprises special PVDC copolymer compositions with good oxygen barrier (OTR<1 cc/m2 day) and high moisture barrier (MVTR<0.5 g/m2 day). As one example, the coating may be used to produce a flexible, high clarity, barrier film for packaging.

Abstract: The present invention is directed generally to methods and apparatus for the efficient identification of components, formulations and materials produced therefrom. More particularly, the invention relates to automated apparatus and associated methods of utilizing arrays of materials for expeditious screening, testing, identification and optimization of formulations of materials and application parameters that provide novel materials having desired physical characteristics.