Abstract: Transparent glass-to-glass hermetic seals are formed by providing a low melting temperature sealing glass along a sealing interface between two glass substrates and irradiating the interface with laser radiation. Absorption by the sealing glass and induced transient absorption by the glass substrates along the sealing interface causes localized heating and melting of both the sealing glass layer and the substrate materials, which results in the formation of a glass-to-glass weld. Due to the transient absorption by the substrate material, the sealed region is transparent upon cooling.

Abstract: A method of forming a hermetic barrier layer comprises sputtering a thin film from a sputtering target, wherein the sputtering target includes a sputtering material such as a low Tg glass, a precursor of a low Tg glass, or an oxide of copper or tin. During the sputtering, the formation of defects in the barrier layer are constrained to within a narrow range and the sputtering material is maintained at a temperature of less than 200° C.

Abstract: A multi-layer thin film laminate comprises a dyad layer including a barrier layer and a decoupling layer formed over a substrate. The barrier layer comprises a hermetic glass material selected from the group consisting of tin fluorophosphate glasses, tungsten-doped tin fluorophosphate glasses, chalcogenide glasses, tellurite glasses, borate glasses and phosphate glasses and the decoupling layer comprises a polymer material.

Abstract: An organic light emitting diode comprising a light extraction substructure and a diode superstructure is provided. The light extraction substructure comprises a light expulsion matrix distributed over discrete light extraction waveguide elements and a waveguide surface of the glass substrate. The light expulsion matrix is distributed at varying thicknesses to enhance the planarity of a diode superstructure-engaging side of the light extraction substructure and to provide light expulsion sites at the waveguide element termination points of the discrete light extraction waveguide elements.

Abstract: A free-standing multi-laminate hermetic sheet includes a first carrier film, a hermetic inorganic thin film formed over the first carrier film, and a second carrier film formed over the hermetic inorganic thin film A workpiece can be hermetically sealed using the multi-laminate sheet, which can be applied to the workpiece in a step separate from a formation step of either the multi-laminate sheet or the workpiece.

Abstract: Described herein are glass substrates having oleophobic surfaces that are substantially free of features that form a reentrant geometry. The surfaces can include a plurality of gas-trapping features, extending from the surface to a depth below the surface, that are substantially isolated from each other. The gas-trapping features are capable of trapping gas below any droplets that are contacted with the surface so as to prevent wetting of the surface by the droplets.

Abstract: A free-standing multi-laminate hermetic sheet includes a first carrier film, a hermetic inorganic thin film formed over the first carrier film, and a second carrier film formed over the hermetic inorganic thin film. A workpiece can be hermetically sealed using the multi-laminate sheet, which can be applied to the workpiece in a step separate from a formation step of either the multi-laminate sheet or the workpiece.

Abstract: A sputtering target comprises a low Tg glass or an oxide of copper or tin. Such target materials can be used to form mechanically-stable thin films that exhibit a self-passivating phenomenon and which can be used to seal sensitive workpieces from exposure to air or moisture. Low Tg glass materials may include phosphate glasses such as tin phosphates and tin fluorophosphates, borate glasses, tellurite glasses and chalcogenide glasses, as well as combinations thereof.

Abstract: A glass-coated gasket comprises a gasket main body defining an inner hole and having a first contact surface and a second contact surface opposite the first contact surface, and a glass layer formed over at least a portion of one of the first contact surface and the second contact surface. The glass layer comprises a low melting temperature glass. A hermetic package comprises a substrate/glass-coated gasket/substrate structure that can be sealed using a thermo-compressive sealing step.

Abstract: Described herein are various methods for making textured articles, textured articles that have improved fingerprint resistance, and methods of using the textured articles. The textured articles generally include a substrate and at least two different sets of nanostructured topographical features that are created in or on a surface of the substrate. Each set of nanostructured topographical features will have at least one average dimensional attribute that is different from that of any other set of nanostructured topographical features.

Abstract: Methods and apparatus provide for: applying an inorganic barrier layer to at least a portion of a flexible substrate, the barrier layer being formed from a low liquidus temperature (LLT) material; and sintering the inorganic barrier layer while maintaining the flexible substrate below a critical temperature.

Abstract: A sealing method for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device (e.g., a hermetically sealed OLED device) are described herein. The sealing method includes the steps of: (1) cooling an un-encapsulated device; (2) depositing a sealing material over at least a portion of the cooled device to form an encapsulated device; and (3) heat treating the encapsulated device to form a hermetically sealed device. In one embodiment, the sealing material is a low liquidus temperature inorganic (LLT) material such as, for example, tin-fluorophosphate glass, tungsten-doped tin fluorophosphate glass, chalcogenide glass, tellurite glass, borate glass and phosphate glass. In another embodiment, the sealing material is a Sn2+-containing inorganic oxide material such as, for example, SnO, SnO+P2O5 and SnO+BPO4.

Abstract: Durable antireflective coatings and glass articles having such coatings are described herein. The antireflective coatings generally include a layer of nominally hexagonally packed nanoparticles that are partially embedded either in a surface of the glass article or in a binder that is on the surface of the glass article. Methods of making the antireflective coatings or layers and glass articles having such antireflective layers are also described.

Abstract: A method for hermetically sealing a device without performing a heat treatment step and the resulting hermetically sealed device are described herein. The method includes the steps of: (1) positioning the un-encapsulated device in a desired location with respect to a deposition device; and (2) using the deposition device to deposit a sealing material over at least a portion of the un-encapsulated device to form a hermetically sealed device without having to perform a post-deposition heat treating step. For instance, the sealing material can be a Sn2+-containing inorganic oxide material or a low liquidus temperature inorganic material.

Abstract: A substrate having a durable hydrophobic and/or oleophobic surface. The durable hydrophobic and/or oleophobic surface includes a first layer that is disposed on the substrate and comprises inorganic nanoparticles, an outer layer comprising a fluorosilane, and an optional immobilizing layer that comprises at least one of an inorganic oxide and a silsesquioxane. The durable surface is capable of retaining optical properties, such as haze, and hydrophobic and/or oleophobic properties after repeated contact with foreign objects such as, for example, wiping with a cloth or human finger.

Abstract: Methods and apparatus provide for: applying an inorganic barrier layer to at least a portion of a flexible substrate, the barrier layer being formed from a low liquidus temperature (LLT) material; and sintering the inorganic barrier layer while maintaining the flexible substrate below a critical temperature.

Abstract: Methods and apparatus provide for: applying an inorganic barrier layer to at least a portion of a flexible substrate, the barrier layer being formed from a low liquidus temperature (LLT) material; and sintering the inorganic barrier layer while maintaining the flexible substrate below a critical temperature.

Abstract: A hermetic thin film includes a first inorganic layer and a second inorganic layer contiguous with the first inorganic layer, wherein the second inorganic layer is formed as a reaction product of the first inorganic layer with oxygen and has a molar volume that is about ?1% to 15% greater than a molar volume of the first inorganic layer. An equilibrium thickness of the second inorganic layer is at least 10% of but less than an as-deposited thickness of the first inorganic layer.

Abstract: A free-standing multi-laminate hermetic sheet includes a first carrier film, a hermetic inorganic thin film formed over the first carrier film, and a second carrier film formed over the hermetic inorganic thin film. A workpiece can be hermetically sealed using the multi-laminate sheet, which can be applied to the workpiece in a step separate from a formation step of either the multi-laminate sheet or the workpiece.

Abstract: A method for hermetically sealing a device without performing a heat treatment step and the resulting hermetically sealed device are described herein. The method includes the steps of: (1) positioning the un-encapsulated device in a desired location with respect to a deposition device; and (2) using the deposition device to deposit a sealing material over at least a portion of the un-encapsulated device to form a hermetically sealed device without having to perform a post-deposition heat treating step. For instance, the sealing material can be a Sn2+-containing inorganic oxide material or a low liquidus temperature inorganic material.