Patents by Inventor Mark Alexander ZALESKI

Mark Alexander ZALESKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of fabricating BEOL interlayer structures
    Patent number: 9362162
    Abstract: Methods are provided for fabricating an interlayer structure useful in, for instance, providing BEOL interconnect for circuit structures. The method includes, for instance, providing an interlayer structure, including: providing an uncured insulating layer above a substrate structure; forming an energy removal film over the uncured insulated layer; forming at least one opening through the energy removal film and extending at least partially into the uncured insulating layer; and applying energy to cure the uncured insulating layer, establishing a cured insulating layer, and decomposing in part the energy removal film, establishing a reduced thickness, energy removal film over the cured insulating layer, the interlayer structure including the cured insulating layer, and the applying energy decreasing an aspect ratio(s) of the one opening(s). In one implementation, the uncured insulating layer includes porogens which also decompose partially during applying energy to further improve the aspect ratio(s).
    Type: Grant
    Filed: August 14, 2014
    Date of Patent: June 7, 2016
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Sunil Kumar Singh, Ravi Prakash Srivastava, Teck Jung Tang, Mark Alexander Zaleski
  • METHODS OF FABRICATING BEOL INTERLAYER STRUCTURES
    Publication number: 20160049327
    Abstract: Methods are provided for fabricating an interlayer structure useful in, for instance, providing BEOL interconnect for circuit structures. The method includes, for instance, providing an interlayer structure, including: providing an uncured insulating layer above a substrate structure; forming an energy removal film over the uncured insulated layer; forming at least one opening through the energy removal film and extending at least partially into the uncured insulating layer; and applying energy to cure the uncured insulating layer, establishing a cured insulating layer, and decomposing in part the energy removal film, establishing a reduced thickness, energy removal film over the cured insulating layer, the interlayer structure including the cured insulating layer, and the applying energy decreasing an aspect ratio(s) of the one opening(s). In one implementation, the uncured insulating layer includes porogens which also decompose partially during applying energy to further improve the aspect ratio(s).
    Type: Application
    Filed: August 14, 2014
    Publication date: February 18, 2016
    Applicant: GLOBALFOUNDRIES INC.
    Inventors: Sunil Kumar SINGH, Ravi Prakash SRIVASTAVA, Teck Jung TANG, Mark Alexander ZALESKI