Abstract: An inverter drive assembly includes a first bus bar having a plurality of bushings, including at least a first bushing and a second bushing, the first bus bar being configured to receive at least one DC link capacitor of the inverter drive assembly via the second bushing, a second bus bar electrically connected to the first bus bar at the first bushing, and an inverter electrically connected to the second bus bar, the inverter being configured to receive electrical current through the second bus bar, wherein a height of the first bushing defines an air gap of approximately 5 millimeters between the first bus bar and the second bus bar.

Abstract: An apparatus is provided that includes a housing for an electronic device. The housing includes a plurality of side walls and a removable exterior housing panel. A circuit board is mechanically attached to a first side of the panel, which faces an interior of the housing when the panel is secured to the plurality of side walls. The panel is made from a heat-conductive material to conduct heat from the circuit board to the panel and exterior environment.