Abstract: A system for controlling air bag deployment in vehicles includes the capability of accommodating varying inductants values in the air bag circuit. Wire harnesses that couple air bag components have varying characteristics, such as length, which affect the inductants value of the circuit. The inventive arrangement utilizes charge and discharge times of at least one capacitor for measuring the inductants of a particular circuit. The system includes a controller that accommodates the inductants by introducing an appropriate delay in the firing circuit signal to operate the air bag.

Abstract: A system for controlling air bag deployment in vehicles includes the capability of accommodating varying inductants values in the air bag circuit. Wire harnesses that couple air bag components have varying characteristics, such as length, which affect the inductants value of the circuit. The inventive arrangement utilizes charge and discharge times of at least one capacitor for measuring the inductants of a particular circuit. The system includes a controller that accommodates the inductants by introducing an appropriate delay in the firing circuit signal to operate the air bag.

Abstract: A single chip sensor processor includes an integrated analog to digital converter (A/D) and digital filter. Analog acceleration signals from a sensor is converted and digitally filtered on-chip in parallel with other processor software executions to effectively increases the bandwidth of the system. The results of the sensor processor calculations may be communicated to a remote microcontroller for deploying a vehicle air bag.

Abstract: An apparatus for packaging a vehicle sensor and integrated circuit chip includes a ceramic substrate having an opening formed therein. A sensor is secured within the opening. An integrated circuit chip is secured within the opening in electrical communication with the sensor. A pair of electrical connectors are secured on the ceramic substrate in electrical communication with the integrated circuit chip. A metal lid is secured over the opening on the ceramic housing to enclose the integrated circuit chip and sensor. A molded plastic coating encloses the ceramic housing and metal lid, and the electrical connectors extend from the plastic coating. The sensor may be a pressure sensor or acceleration sensor.