Abstract: An encapsulation for an organic light emitting diode (OLED) device is disclosed. The encapsulation includes a sealing dam surrounding the cell region of the OLED device to support a cap. Spacer particles are randomly located in the cell region to prevent the cap from contacting the active components, thereby protecting them from damage. The sealing dam provides a sealing region between the edge of the cap and dam in which an adhesive is applied to seal the OLED device. The use of the sealing dam advantageously enables devices to be formed with narrower sealing widths.

Abstract: An encapsulation for a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles comprise a base and an upper portion, the base being at least equal to or wider than the upper portion, for preventing the generation of dark spots around the spacer particles.

Abstract: A method of encapsulating a device is disclosed. Spacer particles are randomly located in a device region to prevent a cap mounted on the substrate from contacting the active components when pressure is applied to the cap, thereby protecting the active components from damage. The spacer particles comprise a base and an upper portion, the base being at least equal to or wider than the upper portion.

Abstract: An encapsulation for a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles are fixed to one side of the substrate to prevent any movement.

Abstract: An OLED device includes pillars, wherein the pillars serve to pattern a conductive layer during deposition. The profile of the pillars covers the edges of at least one functional layer to protect it from exposure to potentially deleterious substances.

Abstract: A method of encapsulating a device is disclosed. Spacer particles are randomly located in a device region to prevent a cap mounted on the substrate from contacting the active components when pressure is applied to the cap, thereby protecting the active components from damage. The spacer particles comprise a base and an upper portion, the base being at least equal to or wider than the upper portion.

Abstract: An OLED device having pillars, wherein the pillars serve to pattern a conductive layer during deposition. The profile of the pillars covers the edges of at least one functional layer to protect it from exposure to potentially deleterious substances.

Abstract: A method of encapsulating a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles are fixed to one side of the substrate to prevent any movement.

Abstract: A method of encapsulating a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles are fixed to one side of the substrate to prevent any movement.

Abstract: An encapsulation procedure for an organic light emitting diode (OLED) device, especially for thin and therefore flexible substrates, is disclosed. The device is sealed hermetically against environmental and mechanical damage. The procedure includes the use of a thin cover lid holder and a substrate holder that are designed to handle thin substrates without damaging them. Thin substrates ensure sufficient mechanical flexibility for the OLED devices, and provides an overall thickness of less than 0.5 mm.

Abstract: A support for facilitating the bending test of flexible substrates is disclosed. The support includes a plastic or adhesive plastic applied on the substrate to keep the shards together after breakage, thereby eliminating the process of collecting the shards and fitting them back together for failure analysis.

Abstract: A barrier stack for sealing devices is described. The barrier stack includes at least first and second base layers bonded together with a high barrier adhesive. A base layer includes a flexible support coated on at least one major surface with a barrier layer. The adhesive advantageously seals defects, such as pinholes in the barrier layer, thus improving the barrier properties.

Abstract: An OLED device having pillars, wherein the pillars serve to pattern a conductive layer during deposition. The profile of the pillars covers the edges of at least one functional layer to protect it from exposure to potentially deleterious substances.

Abstract: An encapsulation for a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles comprise a base and an upper portion, the base being at least equal to or wider than the upper portion, for preventing the generation of dark spots around the spacer particles.

Abstract: An encapsulation for a device is disclosed. Spacer particles are randomly located in the device region to prevent a cap mounted on the substrate from contacting the active components, thereby protecting them from damage. The spacer particles are fixed to one side of the substrate to prevent any movement.

Abstract: An encapsulation for an organic light emitting diode (OLED) device is disclosed. The encapsulation includes a sealing dam surrounding the cell region of the OLED device to support a cap. Spacer particles are randomly located in the cell region to prevent the cap from contacting the active components, thereby protecting them from damage. The sealing dam provides a sealing region between the edge of the cap and dam in which an adhesive is applied to seal the OLED device. The use of the sealing dam advantageously enables devices to be formed with narrower sealing widths.

Abstract: A support for facilitating the bending test of flexible substrates is disclosed. The support includes a plastic or adhesive plastic applied on the substrate to keep the shards together after breakage, thereby eliminating the process of collecting the shards and fitting them back together for failure analysis.

Abstract: An improved barrier stack for sealing devices is described. The barrier stack includes at least first and second base layers bonded together with a high barrier adhesive. A base layer includes a flexible support coated on at least one major surface with a barrier layer. The adhesive advantageously seals defects, such as pinholes in the barrier layer, thus improving the barrier properties.

Abstract: An encapsulation procedure for an organic light emitting diode (OLED) device, especially for thin and therefore flexible substrates, is disclosed. The device is sealed hermetically against environmental and mechanical damage. The procedure includes the use of a thin cover lid holder and a substrate holder that are designed to handle thin substrates without damaging them. Thin substrates ensure sufficient mechanical flexibility for the OLED devices, and provides an overall thickness of less than 0.5 mm.