Abstract: A programmable trim control system for marine applications preferably includes a controller, a control panel, a display device and a plurality of sensors. The controller receives input from the control panel and the plurality of sensors. The display device acts as a monitor for the controller. Each sensor monitors a single drive device, trim device or operational parameter. The controller further includes output ports connected to the drive devices and trim devices for controlling thereof. The trim control system preferably includes a manual mode, a diagnostic mode, a program mode and a preset mode. The positions or settings of the trim and drive devices are set in the program mode and recorded in the controller. Data stored in the controller will be accessed by the trim control system when in the preset mode.

Abstract: The invention is directed thermal interfaced die assemblies and 1-component, 96-100% solids, thermosetting, silver-filled thermal interface based on epoxy resins useful for integrated circuit packages enabling conducting heat generated by the die. The adhesive is placed between the die and lid, lid and heat sink and/or die and the heat sink. The interface adhesive composition comprises an inorganic component and an organic component. The inorganic component comprising thermally conductive filler is present at from 70% 85% by weight, and organic component comprises from 60 to 70 wt. % of a diglycidal ether of a bis-phenol compound, 4 to 30 wt. % of an acyclic aliphatic or cycloaliphatic or mononuclear aromatic diglycidal ether, 3 to 30% of a monofunctional epoxy compound, and 20-30% of a polyamine anhydride adduct.

Abstract: The invention is directed thermal interfaced die assemblies and 1-component, 96-100% solids, thermosetting, silver-filled thermal interface based on epoxy resins useful for integrated circuit packages enabling conducting heat generated by the die. The adhesive is placed between the die and lid, lid and heat sink and/or die and the heat sink. The interface adhesive composition comprises an inorganic component and an organic component. The inorganic component comprising thermally conductive filler is present at from 70% 85% by weight, and organic component comprises from 60 to 70 wt. % of a diglycidal ether of a bis-phenol compound, 4 to 30 wt. % of an acyclic aliphatic or cycloaliphatic or mononuclear aromatic diglycidal ether, 3 to 30% of a monofunctional epoxy compound, and 20-30% of a polyamine anhydride adduct.