Abstract: A thin film circuit module constructed for serial coupling to circuit conductors at printed and transmission line circuits. In one form of equalizer construction, thin film circuit elements are deposited on a supporting substrate and wherein a capacitor plate is defined a circuit resistor. Two connector applications serially couple the equalizer modules to trace conductors of a motherboard connector block and to cylindrical core conductors of a coaxial connector. Other hybrid equalizer constructions provide modules constructed of thin film resistors and pick-and-placed capacitors mounted piggyback to an equalizer module substrate.

Abstract: A coupling facility is coupled to one or more other coupling facilities via one or more peer links. The coupling of the facilities enables various functions to be supported, including the duplexing of structures of the coupling facilities. Duplexing is performed on a structure basis, and thus, a coupling facility may include duplexed structures, as well as non-duplexed or simplexed structures.

Abstract: System-managed duplexing of coupling facility structures. A plurality of instances of coupling facility structures are maintained in a plurality of coupling facilities. Duplexing processing associated with the plurality of instances is managed by one or more operating systems, making many of the steps associated with duplexing transparent to the exploiters of the coupling facility structures. System-managed duplexing provides high availability for coupling facility structure data via a robust recovery mechanism (i.e., duplexing failover).

Abstract: Storage structures of a shared storage processor of a computing environment are copied. A copy operation for a storage structure of the shared storage processor is initiated. Although the storage structure is owned by an exploiter of the storage structure, at least a portion of the contents of the storage structure is copied via an operating system of the computing environment. The at least a portion of the contents are copied from the storage structure to another storage structure of the computing environment. Both storage structures may be located within the same shared storage processor or within different shared storage processors.

Abstract: Conformal-coated devices packaged to be compatible with automated handling equipment. In one arrangement, open-sided, injection-molded shells are mounted around conformal-coated devices to provide dimensionally stable packaging that is compatible with device carriers and automated packaging tool heads that are indexed to select and place the devices. In another arrangement, the coating is heated and additional material is added and re-flowed to define unique surface regions compatible with automated handling equipment.

Abstract: Conformal-coated devices packaged to be compatible with automated handling equipment. In one arrangement, open-sided, injection-molded shells are mounted around conformal-coated devices to provide dimensionally stable packaging that is compatible with device carriers and automated packaging tool heads that are indexed to select and place the devices. In another arrangement, the coating is heated and additional material is added and re-flowed to define unique surface regions compatible with automated handling equipment.

Abstract: Cache structures of a shared storage processor of a computing environment are copied. A copy operation for a cache structure of the shared storage processor is initiated. Although the cache structure is owned by an exploiter of the cache structure, one or more objects of the cache structure are copied via an operating system of the computing environment. The one or more objects are copied from the cache structure to another cache structure of the computing environment. Both cache structures may be located within the same shared storage processor or within different shared storage processors.

Abstract: Lock structures of a shared storage processor of a computing environment are copied. A copy operation for a lock structure of the shared storage processor is initiated. Although the lock structure is owned by an exploiter of the lock structure, one or more objects of the lock structure are copied via an operating system of the computing environment. The one or more objects are copied from the lock structure to another lock structure of the computing environment. Both lock structures may be located within the same shared storage processor or within different shared storage processors.

Abstract: System-managed duplexing of coupling facility structures. A plurality of instances of coupling facility structures are maintained in a plurality of coupling facilities. Duplexing processing associated with the plurality of instances is managed by one or more operating systems, making many of the steps associated with duplexing transparent to the exploiters of the coupling facility structures. System-managed duplexing provides high availability for coupling facility structure data via a robust recovery mechanism (i.e., duplexing failover).

Abstract: List structures of a shared storage processor of a computing environment are copied. A copy operation for a list structure of the shared storage processor is initiated. Although the list structure is owned by an exploiter of the list structure, one or more objects of the list structure are copied via an operating system of the computing environment. The one or more objects are copied from the list structure to another list structure of the computing environment. Both list structures may be located within the same shared storage processor or within different shared storage processors.

Abstract: The preferred embodiments described herein provide a method and system for displaying medical data at an automatically-selected display resolution. In one preferred embodiment, medical data is automatically analyzed, and based on the analysis, a display resolution is automatically selected. The medical data is then displayed with the automatically-selected display resolution. By automatically selecting a display resolution based on an analysis of medical data, the appearance of medical data is optimized without conscious effort by a user. Other preferred embodiments are provided.

Abstract: Thin film, multi-layered components wherein the layers are hermetically sealed with a re-flowed conductive sealant (e.g. Pb/Sn solder). The sealant is applied to an endless ground conductor at the peripheral edge of at least one of each pair of opposed substrate layers prior to registering the conductors and re-flowing the sealant. The microstrip conductors comprise thin film adhesion and seed layers and a covering metalization. The signal and ground conductors are terminated with solder balls and the signal and ground conductors are connected with micro vias that extend through the substrates.

Abstract: Thin film, multi-layered components wherein the layers are hermetically sealed with a re-flowed conductive sealant (e.g. Pb/Sn solder). The sealant is applied to an endless ground conductor at the peripheral edge of at least one of each pair of opposed substrate layers prior to registering the conductors and re-flowing the sealant. The microstrip conductors comprise thin film adhesion and seed layers and a covering metalization. The signal and ground conductors are terminated with solder balls and the signal and ground conductors are connected with micro vias that extend through the substrates.

Abstract: Modular thin film, distributed, lumped element band-pass filters. The filter circuitry is configured on a number of ceramic substrates. The component defining depositions are arranged to overlap and couple to one another with connecting vias. Alternative band-pass filter and delay line circuits are disclosed that provide desirable delay characteristics. Bordering ground conductors and covering ground planes shield lumped impedance resonator and overlapping capacitor elements and/or provide a hermetic seal between the layers. The assemblies are configured to accommodate a range of frequencies and permit pre-fabrication with subsequent laser trimming, assembly and packaging.

Abstract: The modular rail assembly of the present invention includes at least one post, at least one rail, and at least one sleeve. The post is mounted to a surface and preferably extends upward. A sleeve is inserted into openings in the post. The openings are on opposite sides of the post. The sleeve preferably has a flange that contacts the post and prevents the sleeve from sliding completely thorough the openings. A rail is slid through the sleeve and preferably extends parallel to the surface. A single rail can extend through several posts. The sleeve acts as a buffer and protects the rail finish from being scratched or damaged by the post. Because of the sleeve, the modular rail assembly can be reassembled in any position without showing scratch marks or unpainted portions of the rail. In the preferred embodiment, a cap covers the top end of the post. There is also an opening in the cap into which a sleeve is inserted. A rail is slid through the sleeve and cap, similar to the rail and the post.

Abstract: Rebuilding of storage structures within a shared storage processor of a computing environment. A rebuild of a storage structure, which is owned by an exploiter of the storage structure, is initiated. Thereafter, the storage structure is rebuilt via an operating system of the computing environment. The operating system is distinct from the exploiter owning the storage structure and lacks knowledge of the contents of the storage structure.

Abstract: A modular thin film, distributed, lumped element band-pass filter. The filter circuitry is configured on a number of ceramic substrates. The component defining depositions are arranged to overlap and couple to one another with connecting vias. Alternative 800 MHz and 1.9 GHz band-pass filter circuits are disclosed. Bordering ground conductors and covering ground planes shield lumped impedance resonator and overlapping capacitor elements. The layers are configured to accommodate a range of frequencies and permit pre-fabrication with subsequent laser trimming, assembly and packaging.

Abstract: A thin film differential delay line configured in a strip line assembly on ceramic substrates for PECL logic applications. A number of alternative layered constructions are disclosed. Each assembly provides complementary serpentine conductors constructed in symmetrical arrangements, i.e. side-by-side, over-under and mirrored. Bordering ground conductors at the signal layer and adjacent ground planes layers shield the delay line conductors. Termination pads having plated through vias facilitate electrical couplings between the layers.

Abstract: A thin film transmission line, delay line constructed on a ceramic substrate. A serpentine, transmission line conductor and a surrounding, coplanar border ground are plated in registry onto the substrate. Discrete ground paths which project from the border are interspersed between the conductor windings to electrically shield adjacent windings. A hard coat epoxy resin covers the signal layer, which may support a sputtered ground plane that is connected to the border ground. An alternative delay line provides overlying ground fingers within the dielectric covering layer which are aligned to the channel spaces between the conductor windings. Both assemblies provide an increased number of conductor lines per chip. Edge coupled terminations are provided at the substrate to accommodate multi-layer assemblies of the delay line and/or circuit terminations.

Abstract: A method of refining magma, which includes silicon carbide, basaltic clay, and other insoluble components, including the steps of blending the magma with monovalent alkali hydroxides and a chemical oxidizing agent, melting the magma, and injecting oxygen into the melted magma. The melted magma is electrolyzed to separate metals contained in the melt, which are recovered by gravity separation followed by centrifugation. Soluble silicates are recovered by crystallization.